Patent Assignment Details
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| Reel/Frame: | 024834/0819 | |
| Pages: | 10 |
| | Recorded: | 08/11/2010 | | |
| Attorney Dkt #: | 1138 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/18/2014
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Application #:
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12452665
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Filing Dt:
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08/11/2010
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Publication #:
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Pub Dt:
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12/09/2010
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Title:
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INDIUM-CONTAINING LEAD-FREE SOLDER FOR VEHICLE-MOUNTED ELECTRONIC CIRCUITS
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Assignee
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| 23 SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO 120-8555, JAPAN |
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Correspondence name and address
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MICHAEL TOBIAS
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1629 K STREET N.W., SUITE 300
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WASHINGTON, D.C. 20006
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