Patent Assignment Details
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| Reel/Frame: | 024848/0488 | |
| Pages: | 8 |
| | Recorded: | 08/17/2010 | | |
| Attorney Dkt #: | 779-P-004PASS |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/27/2013
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Application #:
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12734438
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Filing Dt:
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08/09/2010
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Publication #:
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Pub Dt:
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12/09/2010
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Title:
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PLATING APPARATUS FOR METALLIZATION ON SEMICONDUCTOR WORKPIECE
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Assignee
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| 1690 CAI LUN ROAD BUILDING 4 |
| ZHANGJIANG HING-TECH PARK PUDONG DISTRICT |
| SHANGHAI, CHINA 201203 |
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Correspondence name and address
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GLORIA TSUI-YIP
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1350 BROADWAY
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SUITE 802
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NEW YORK, NY 10018
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