Patent Assignment Details
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| Reel/Frame: | 024872/0181 | |
| Pages: | 4 |
| | Recorded: | 08/23/2010 | | |
| Attorney Dkt #: | OGOSH14BUSA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/17/2011
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Application #:
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12861161
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Filing Dt:
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08/23/2010
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Publication #:
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Pub Dt:
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12/09/2010
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Title:
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ELECTROLYTIC COPPER PLATING METHOD, PURE COPPER ANODE FOR ELECTROLYTIC COPPER PLATING, AND SEMICONDUCTOR WAFER HAVING LOW PARTICLE ADHESION PLATED WITH SAID METHOD AND ANODE
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Assignee
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| 10-1, TORANOMON 2-CHOME |
| MINATO-KU |
| TOKYO, JAPAN 105-8407 |
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Correspondence name and address
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WILLIAM BAK
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501 OFFICE CENTER DRIVE
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SUITE 210
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FORT WASHINGTON, PA 19034
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