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Reel/Frame:024941/0942   Pages: 2
Recorded: 09/03/2010
Attorney Dkt #:AGSGP012
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/19/2010
Application #:
11662431
Filing Dt:
08/22/2007
Publication #:
Pub Dt:
06/26/2008
Title:
MULTI-DIE IC PACKAGE AND MANUFACTURING METHOD
Assignors
1
Exec Dt:
03/16/2007
2
Exec Dt:
03/09/2007
3
Exec Dt:
04/02/2007
4
Exec Dt:
03/14/2007
5
Exec Dt:
04/12/2007
6
Exec Dt:
03/10/2007
Assignee
1
5 SERANGOON NORTH AVE 5
SINGAPORE 554916
Correspondence name and address
MARTINE PENILLA & GENCARELLA, LLP
710 LAKEWAY DRIVE
SUITE 200
SUNNYVALE, CA 94085

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