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Patent Assignment Details
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Reel/Frame:024953/0596   Pages: 3
Recorded: 09/08/2010
Attorney Dkt #:TIPI 5 2-015
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 8
1
Patent #:
Issue Dt:
05/26/1998
Application #:
08516614
Filing Dt:
08/18/1995
Title:
PROCESS FOR FORMING METAL INTERCONNECT STRUCTURES FOR USE WITH INTEGRATED CIRCUIT DEVICES TO FORM INTEGRATED CIRCUIT STRUCTURES
2
Patent #:
Issue Dt:
12/29/1998
Application #:
08638898
Filing Dt:
04/24/1996
Title:
MULTI-LAYER TAB TAPE HAVING DISTINCT SIGNAL, POWER AND GROUND PLANES, SEMICONDUCTOR DEVICE ASSEMBLY EMPLOYING SAME, APPARATUS FOR AND METHOD OF ASSEMBLING SAME
3
Patent #:
Issue Dt:
09/29/1998
Application #:
08660490
Filing Dt:
06/07/1996
Title:
SEMICONDUCTOR DIE WITH STAGGERED BOND PADS
4
Patent #:
Issue Dt:
08/18/1998
Application #:
08712981
Filing Dt:
09/16/1996
Title:
PROGRESSIVE STAGGERED BONDING PADS
5
Patent #:
Issue Dt:
12/03/2002
Application #:
09703199
Filing Dt:
10/31/2000
Title:
MOLDED TAPE BALL GRID ARRAY PACKAGE
6
Patent #:
Issue Dt:
08/17/2004
Application #:
10164494
Filing Dt:
06/06/2002
Title:
INTEGRATED CIRCUIT PACKAGE SUBSTRATE WITH MULTIPLE VOLTAGE SUPPLIES
7
Patent #:
Issue Dt:
11/30/2004
Application #:
10308310
Filing Dt:
12/03/2002
Publication #:
Pub Dt:
06/03/2004
Title:
STIFFENER DESIGN
8
Patent #:
Issue Dt:
09/02/2008
Application #:
10873387
Filing Dt:
06/22/2004
Publication #:
Pub Dt:
12/22/2005
Title:
HEAT SPREADER IN INTEGRATED CIRCUIT PACKAGE
Assignor
1
Exec Dt:
08/18/2010
Assignee
1
3025 ORCHARD PARKWAY
SAN JOSE, CALIFORNIA 95134
Correspondence name and address
DARYL K. NEFF
LERNER, DAVID, LITTENBERG, ET AL
600 SOUTH AVENUE WEST
WESTFIELD, NEW JERSEY 07090

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