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Patent Assignment Details

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Reel/Frame:	024982/0803			Pages:	10
		Recorded:	09/15/2010
Attorney Dkt #:	MERGER
Conveyance:	MERGER (SEE DOCUMENT FOR DETAILS).

Total properties: 46

Patent #:	5334688	Issue Dt:	08/02/1994	Application #:	08049097	Filing Dt:	04/19/1993
Title:	FULLY SUBSTITUTED CYCLOPOLYSILOXANES AND THEIR USE FOR MAKING ORGANOSILICON POLYMERS

Patent #:	5319020	Issue Dt:	06/07/1994	Application #:	08050944	Filing Dt:	04/21/1993
Title:	REDISPERSIBLE WATERBORNE PRESSURE SENSITIVE ADHESIVE POLYMER

Patent #:	5346558	Issue Dt:	09/13/1994	Application #:	08082653	Filing Dt:	06/28/1993
Title:	SOLDERABLE ANISOTROPICALLY CONDUCTIVE COMPOSITION AND METHOD OF USING SAME

Patent #:	5408026	Issue Dt:	04/18/1995	Application #:	08110685	Filing Dt:	08/23/1993
Title:	CURABLE AND CURED ORGANOSILICON COMPOSITIONS, AND PROCESS FOR MAKING SAME

Patent #:	5310835	Issue Dt:	05/10/1994	Application #:	08130069	Filing Dt:	09/30/1993
Title:	TRANSPARENT TWO-PART ACRYLIC ADHESIVE COMPOSITION AND THE METHOD OF USE THEREOF

Patent #:	5523374	Issue Dt:	06/04/1996	Application #:	08141653	Filing Dt:	10/26/1993
Title:	CURABLE AND CURED ORGANOSILICON COMPOSITIONS

Patent #:	5416127	Issue Dt:	05/16/1995	Application #:	08186727	Filing Dt:	01/26/1994
Title:	RADIATION CURABLE HOT MELT PRESSURE SENSITIVE ADHESIVES

Patent #:	5536855	Issue Dt:	07/16/1996	Application #:	08206778	Filing Dt:	03/04/1994
Title:	PROCESS FOR GLYCIDYL ESTERS FOR USE IN ELECTRONICS ADHESIVES

Patent #:	5391406	Issue Dt:	02/21/1995	Application #:	08217574	Filing Dt:	03/25/1994
Title:	PROCESS OF PREPARING HOT MELT PRESSURE SENSITIVE ADHESIVES ON A SUBSTRATE

Patent #:	5451637	Issue Dt:	09/19/1995	Application #:	08241243	Filing Dt:	05/10/1994
Title:	ORGANOSILICON COMPOSITIONS PREPARED FROM UNSATURATED ELASTOMERIC POLYMERS

Patent #:	5512376	Issue Dt:	04/30/1996	Application #:	08262190	Filing Dt:	06/20/1994
Title:	NONPOLAR POLYMERS COMPRISING ANTIPLASTICIZERS

Patent #:	5491249	Issue Dt:	02/13/1996	Application #:	08425542	Filing Dt:	04/20/1995
Title:	PROCESS FOR PREPARING CYCLIC POLYSILOXANES FROM LINEAR POLYSILOXANES

Patent #:	5855821	Issue Dt:	01/05/1999	Application #:	08577256	Filing Dt:	12/22/1995
Title:	MATERIALS FOR SEMICONDUCTOR DEVICE ASSEMBLIES

Patent #:	5723636	Issue Dt:	03/03/1998	Application #:	08631388	Filing Dt:	04/12/1996
Title:	METHYLTRIOXORHENIUM-UREA HYDROGEN PEROXIDE EPOXIDATION OF OLEFINS

Patent #:	5646315	Issue Dt:	07/08/1997	Application #:	08656597	Filing Dt:	05/31/1996
Title:	POLYGLYDICYLPHENYL ETHERS OF ALKYEOXY CHAINS FOR USE IN MICRO- ELECTRONICS ADHESIVES

Patent #:	5717054	Issue Dt:	02/10/1998	Application #:	08656619	Filing Dt:	05/31/1996
Title:	EPOXY RESINS CONSISTING OF FLEXIBLE CHAINS TERMINATED WITH GLYCIDYLOXYPHENYL GROUPS FOR USE IN MICROELECTRONICS ADHESIVES

Patent #:	5770706	Issue Dt:	06/23/1998	Application #:	08656621	Filing Dt:	05/31/1996
Title:	SNAP-CURE EPOXY ADHESIVES

Patent #:	5783621	Issue Dt:	07/21/1998	Application #:	08664200	Filing Dt:	06/10/1996
Title:	METHOD OF DECREASING BLEED FROM ORGANIC-BASED FORMULATIONS AND ANTI- BLEED COMPOSITIONS

Patent #:	5852092	Issue Dt:	12/22/1998	Application #:	08798863	Filing Dt:	02/11/1997
Title:	ORGANOSILICON-CONTAINING COMPOSITIONS HAVING ENHANCED ADHESIVE PROPERTIES

Patent #:	5859105	Issue Dt:	01/12/1999	Application #:	08798864	Filing Dt:	02/11/1997
Title:	ORGANOSILICON-CONTAINING COMPOSITIONS CAPABLE OF RAPID CURING AT LOW TEMPERATURE

Patent #:	5912316	Issue Dt:	06/15/1999	Application #:	08859792	Filing Dt:	05/19/1997
Title:	FLEXIBLE INTERPENETRATING NETWORKS FORMED BY EPOXY-CYANATE ESTER COMPOSITIONS VIA A POLYAMIDE

Patent #:	5744533	Issue Dt:	04/28/1998	Application #:	08868508	Filing Dt:	06/04/1997
Title:	ADHESIVE COMPOSITION FOR BONDING A SEMICONDUCTOR DEVICE

Patent #:	5859110	Issue Dt:	01/12/1999	Application #:	08935575	Filing Dt:	09/23/1997
Title:	METHOD OF DECREASING BLEED FROM ORGANIC-BASED FORMULATIONS AND ANTI-BLEED COMPOSITIONS

Patent #:	6070427	Issue Dt:	06/06/2000	Application #:	08948550	Filing Dt:	10/10/1997
Title:	METHOD FOR SHIPPING EXOTHERMIC MATERIALS

Patent #:	5922627	Issue Dt:	07/13/1999	Application #:	08953586	Filing Dt:	10/17/1997
Title:	LOW RESISTIVITY PALLADIUM-SILVER COMPOSITIONS

Patent #:	6022616	Issue Dt:	02/08/2000	Application #:	09012354	Filing Dt:	01/23/1998
Title:	ADHESIVE COMPOSITION WITH SMALL PARTICLE SIZE FOR MICROELECTRONIC DEVICES

Patent #:	5962547	Issue Dt:	10/05/1999	Application #:	09078768	Filing Dt:	05/14/1998
Title:	REACTIVE RADIATION- OR THERMALLY-INITIATED CATIONICALLY-CURABLE EPOXIDE MONOMERS AND COMPOSITIONS MADE FROM THOSE MONOMERS

Patent #:	6117930	Issue Dt:	09/12/2000	Application #:	09109976	Filing Dt:	07/02/1998
Title:	RESIN SYSTEMS FOR ORGANOSILICON-CONTAINING COMPOSITIONS

Patent #:	6063828	Issue Dt:	05/16/2000	Application #:	09110047	Filing Dt:	07/02/1998
Title:	UNDERFILL ENCAPSULANT COMPOSITIONS FOR USE IN ELECTRONIC DEVICES

Patent #:	6057381	Issue Dt:	05/02/2000	Application #:	09110080	Filing Dt:	07/02/1998
Title:	METHOD OF MAKING AN ELECTRONIC COMPONENT USING REWORKABLE UNDERFILL ENCAPSULANTS

Patent #:	5972735	Issue Dt:	10/26/1999	Application #:	09115064	Filing Dt:	07/14/1998
Title:	METHOD OF PREPARING AN ELECTRONIC PACKAGE BY CO-CURING ADHESIVE AND ENCAPSULANT

Patent #:	6057402	Issue Dt:	05/02/2000	Application #:	09133507	Filing Dt:	08/12/1998
Title:	LONG AND SHORT-CHAIN CYCLOALIPHATIC EPOXY RESINS WITH CYANATE ESTER

Patent #:	6008413	Issue Dt:	12/28/1999	Application #:	09231039	Filing Dt:	01/14/1999
Title:	PROCESS FOR RECRYSTALLZING 1,3-BIS(AMINOPHENOXY BENZENE)

Patent #:	6165613	Issue Dt:	12/26/2000	Application #:	09264999	Filing Dt:	03/09/1999
Title:	ADHESIVE PASTE FOR SEMICONDUCTORS

Patent #:	6316566	Issue Dt:	11/13/2001	Application #:	09336246	Filing Dt:	06/18/1999
Title:	PACKAGE ENCAPSULANT COMPOSITIONS FOR USE IN ELECTRONIC DEVICES

Patent #:	6180187	Issue Dt:	01/30/2001	Application #:	09469479	Filing Dt:	12/22/1999
Title:	METHOD OF MAKING AN ELECTRONIC COMPONENT UISING REWORKABLE UNDERFILL ENCAPSULANTS

Patent #:	6355750	Issue Dt:	03/12/2002	Application #:	09549639	Filing Dt:	04/14/2000
Title:	Die attach adhesives for use in microelectronic devices

Patent #:	6307001	Issue Dt:	10/23/2001	Application #:	09573376	Filing Dt:	05/18/2000
Title:	Curable hybrid electron donor compounds containing vinyl ether

Patent #:	6441213	Issue Dt:	08/27/2002	Application #:	09573804	Filing Dt:	05/18/2000
Title:	ADHESION PROMOTERS CONTAINING SILANE, CARBAMATE OR UREA, AND DONOR OR ACCEPTOR FUNCTIONALITY

Patent #:	6300456	Issue Dt:	10/09/2001	Application #:	09573838	Filing Dt:	05/18/2000
Title:	Compounds with electron donor and electron acceptor functionality

Patent #:	6750301	Issue Dt:	06/15/2004	Application #:	09611899	Filing Dt:	07/07/2000
Title:	DIE ATTACH ADHESIVES WITH EPOXY COMPOUNDS OR RESINS HAVING ALLYL OR VINYL GROUPS

Patent #:	6462108	Issue Dt:	10/08/2002	Application #:	09620170	Filing Dt:	07/20/2000
Title:	HIGH TG POTTING COMPOUND

Patent #:	6572790	Issue Dt:	06/03/2003	Application #:	09757210	Filing Dt:	01/09/2001
Publication #:	US20020148107	Pub Dt:	10/17/2002
Title:	CATHODE COATING DISPERSION

Patent #:	6344157	Issue Dt:	02/05/2002	Application #:	09782421	Filing Dt:	02/13/2001
Title:	Conductive and resistive materials with electrical stability for use in electronics devices

Patent #:	6583201	Issue Dt:	06/24/2003	Application #:	09841980	Filing Dt:	04/25/2001
Publication #:	US20020193467	Pub Dt:	12/19/2002
Title:	CONDUCTIVE MATERIALS WITH ELECTRICAL STABILITY FOR USE IN ELECTRONICS DEVICES

Patent #:	6492437	Issue Dt:	12/10/2002	Application #:	09887450	Filing Dt:	06/21/2001
Title:	SOLVENT-BASED PROCESS FOR MANUFACTURING LATENT CURING CATALYSTS

Assignor

NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION

Exec Dt:

01/05/2009

Assignee

HENKEL CORPORATION

ONE HENKEL WAY

ROCKY HILL, CONNECTICUT 06067

Correspondence name and address
	HENKEL CORPORATION
	10 FINDERNE AVENUE
	PATENT DEPARTMENT
	BRIDGEWATER, NJ 08807

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