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Patent Assignment Details
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Reel/Frame:024996/0272   Pages: 9
Recorded: 09/16/2010
Attorney Dkt #:35706-133743
Conveyance: CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Total properties: 19
1
Patent #:
NONE
Issue Dt:
Application #:
10380291
Filing Dt:
03/10/2003
Publication #:
US20030188814
Pub Dt:
10/09/2003
Title:
High-strength copper alloys with excellent bending workability, and terminal connectors using the same
2
Patent #:
NONE
Issue Dt:
Application #:
11371469
Filing Dt:
03/09/2006
Publication #:
US20060204396
Pub Dt:
09/14/2006
Title:
Titanium copper alloy having excellent punchability
3
Patent #:
NONE
Issue Dt:
Application #:
11654864
Filing Dt:
01/18/2007
Publication #:
US20080175746
Pub Dt:
07/24/2008
Title:
Cu-Ni-Si system copper alloy for electronic materials
4
Patent #:
8317948
Issue Dt:
11/27/2012
Application #:
11886829
Filing Dt:
10/11/2007
Publication #:
US20090035174
Pub Dt:
02/05/2009
Title:
COPPER ALLOY FOR ELECTRONIC MATERIALS
5
Patent #:
8070893
Issue Dt:
12/06/2011
Application #:
11887660
Filing Dt:
09/28/2007
Publication #:
US20090025840
Pub Dt:
01/29/2009
Title:
CU-NI-SI-CO-CR COPPER ALLOY FOR ELECTRONIC MATERIALS AND METHOD FOR MANUFACTURING SAME
6
Patent #:
8182932
Issue Dt:
05/22/2012
Application #:
11988116
Filing Dt:
12/31/2007
Publication #:
US20090130480
Pub Dt:
05/21/2009
Title:
SN-PLATED COPPER ALLOY STRIP HAVING IMPROVED FATIGUE CHARACTERISTICS
7
Patent #:
NONE
Issue Dt:
Application #:
11989888
Filing Dt:
01/30/2008
Publication #:
US20100101687
Pub Dt:
04/29/2010
Title:
High strength copper alloy for electronic parts and electronic parts
8
Patent #:
NONE
Issue Dt:
Application #:
12082531
Filing Dt:
04/11/2008
Publication #:
US20080210353
Pub Dt:
09/04/2008
Title:
High-strength copper alloys with excellent bending workability and terminal connectors using the same
9
Patent #:
8697233
Issue Dt:
04/15/2014
Application #:
12224684
Filing Dt:
09/03/2008
Publication #:
US20090042021
Pub Dt:
02/12/2009
Title:
METAL-COATED LIPID BILAYER VESICLES AND PROCESS FOR PRODUCING SAME
10
Patent #:
8524376
Issue Dt:
09/03/2013
Application #:
12226631
Filing Dt:
10/23/2008
Publication #:
US20090092851
Pub Dt:
04/09/2009
Title:
HEAT-RESISTANT SN-PLATED CU-ZN ALLOY STRIP WITH SUPPRESSED WHISKERING
11
Patent #:
NONE
Issue Dt:
Application #:
12226635
Filing Dt:
10/23/2008
Publication #:
US20090176125
Pub Dt:
07/09/2009
Title:
Sn-Plated Cu-Ni-Si Alloy Strip
12
Patent #:
7972709
Issue Dt:
07/05/2011
Application #:
12227765
Filing Dt:
11/26/2008
Publication #:
US20090239094
Pub Dt:
09/24/2009
Title:
CU-ZN ALLOY STRIP SUPERIOR IN THERMAL PEEL RESISTANCE OF SN PLATING AND SN PLATING STRIP THEREOF
13
Patent #:
8114309
Issue Dt:
02/14/2012
Application #:
12310172
Filing Dt:
02/13/2009
Publication #:
US20090289218
Pub Dt:
11/26/2009
Title:
LITHIUM-MANGANESE COMPOSITE OXIDES FOR LITHIUM ION BATTERY AND PROCESS FOR PREPARING SAME
14
Patent #:
NONE
Issue Dt:
Application #:
12311401
Filing Dt:
03/25/2009
Publication #:
US20100000637
Pub Dt:
01/07/2010
Title:
Cu-ni-si system alloy
15
Patent #:
8444779
Issue Dt:
05/21/2013
Application #:
12312990
Filing Dt:
06/03/2009
Publication #:
US20090301614
Pub Dt:
12/10/2009
Title:
CU-NI-SI-CO COPPER ALLOY FOR ELECTRONIC MATERIALS AND METHOD FOR MANUFACTURING SAME
16
Patent #:
NONE
Issue Dt:
Application #:
12532929
Filing Dt:
09/24/2009
Publication #:
US20100086435
Pub Dt:
04/08/2010
Title:
Cu-Ni-Si SYSTEM ALLOY FOR ELECTRONIC MATERIALS
17
Patent #:
8318313
Issue Dt:
11/27/2012
Application #:
12678509
Filing Dt:
03/30/2010
Publication #:
US20100215970
Pub Dt:
08/26/2010
Title:
METHOD FOR SUPPORTING METAL NANOPARTICLES AND METAL NANOPARTICLES-CARRYING SUBSTRATE
18
Patent #:
NONE
Issue Dt:
Application #:
12740784
Filing Dt:
04/30/2010
Publication #:
US20100266863
Pub Dt:
10/21/2010
Title:
Sn-PLATED MATERIALS FOR ELECTRONIC COMPONENTS
19
Patent #:
8148245
Issue Dt:
04/03/2012
Application #:
12743593
Filing Dt:
08/30/2011
Publication #:
US20110306165
Pub Dt:
12/15/2011
Title:
METHOD FOR PRODUCING A-IGZO OXIDE THIN FILM
Assignor
1
NIPPON MINING HOLDINGS, INC.
Exec Dt:
07/01/2010
Assignee
1
JX NIPPON MINING & METALS CORPORATION
6-3, OTEMACHI 2-CHOME
CHIYODA-KU, TOKYO, JAPAN 100-0004
Correspondence name and address
DRINKER BIDDLE & REATH LLP
ONE LOGAN SQUARE, STE. 2000
PHILADELPHIA, PA 19103

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