Patent Assignment Details
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| Reel/Frame: | 025104/0470 | |
| Pages: | 4 |
| | Recorded: | 10/07/2010 | | |
| Attorney Dkt #: | I446.174.102 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/19/2012
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Application #:
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12899642
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Filing Dt:
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10/07/2010
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Publication #:
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Pub Dt:
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02/03/2011
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Title:
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SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR CHIP ASSEMBLY, AND METHOD FOR FABRICATING A DEVICE
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Assignee
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| AM CAMPEON 1-12 |
| NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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DICKE, BILLIG & CZAJA
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FIFTH STREET TOWERS
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100 SOUTH FIFTH STREET, SUITE 2250
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MINNEAPOLIS, MN 55402
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