skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:025123/0420   Pages: 8
Recorded: 10/12/2010
Attorney Dkt #:OGOSHI-CHANGE OF NAME2
Conveyance: CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Total properties: 51
1
Patent #:
Issue Dt:
02/20/2018
Application #:
10501117
Filing Dt:
01/14/2005
Publication #:
Pub Dt:
06/09/2005
Title:
Copper alloy sputtering target and method for manufacturing the target
2
Patent #:
Issue Dt:
01/18/2011
Application #:
10507235
Filing Dt:
09/09/2004
Publication #:
Pub Dt:
05/05/2005
Title:
SPUTTERING TARGET TRANSPORT BOX
3
Patent #:
Issue Dt:
05/16/2017
Application #:
12023588
Filing Dt:
01/31/2008
Publication #:
Pub Dt:
01/08/2009
Title:
Method for Connecting Magnetic Substance Target to Backing Plate, and Magnetic Substance Target
4
Patent #:
Issue Dt:
08/28/2012
Application #:
12041095
Filing Dt:
03/03/2008
Publication #:
Pub Dt:
09/04/2008
Title:
ELECTROLYTIC COPPER PLATING METHOD, PHOSPHOROUS COPPER ANODE FOR ELECTROLYTIC COPPER PLATING, AND SEMICONDUCTOR WAFER HAVING LOW PARTICLE ADHESION PLATED WITH SAID METHOD AND ANODE
5
Patent #:
Issue Dt:
04/19/2011
Application #:
12297789
Filing Dt:
10/20/2008
Publication #:
Pub Dt:
04/23/2009
Title:
ZIRCONIUM CRUCIBLE FOR MELTING ANALYTICAL SAMPLE, METHOD OF PREPARING ANALYTICAL SAMPLE AND METHOD OF ANALYSIS
6
Patent #:
NONE
Issue Dt:
Application #:
12300173
Filing Dt:
11/10/2008
Publication #:
Pub Dt:
01/21/2010
Title:
Cu-Mn Alloy Sputtering Target and Semiconductor Wiring
7
Patent #:
Issue Dt:
06/13/2017
Application #:
12302319
Filing Dt:
11/25/2008
Publication #:
Pub Dt:
09/17/2009
Title:
Target formed of Sintering-Resistant Material of High-Melting Point Metal Alloy, High-Melting Point Metal Silicide, High-Melting Point Metal Carbide, High-Melting Point Metal Nitride, or High-Melting Point Metal Boride, Process for Producing the Target, Assembly of the Sputtering Target-Backing Plate, and Process for Producing the Same
8
Patent #:
Issue Dt:
05/28/2013
Application #:
12303899
Filing Dt:
01/05/2009
Publication #:
Pub Dt:
06/25/2009
Title:
Rolled Copper or Copper Alloy Foil with Roughened Surface and Method of Roughening Rolled Copper or Copper Alloy Foil
9
Patent #:
Issue Dt:
04/17/2012
Application #:
12306734
Filing Dt:
12/29/2008
Publication #:
Pub Dt:
11/12/2009
Title:
SPUTTERING TARGET/BACKING PLATE BONDED BODY
10
Patent #:
Issue Dt:
08/30/2011
Application #:
12307380
Filing Dt:
01/05/2009
Publication #:
Pub Dt:
08/13/2009
Title:
ZINC OXIDE BASED TRANSPARENT ELECTRIC CONDUCTOR, SPUTTERING TARGET FOR FORMING OF THE CONDUCTOR AND PROCESS FOR PRODUCING THE TARGET
11
Patent #:
Issue Dt:
11/11/2014
Application #:
12444859
Filing Dt:
04/21/2009
Publication #:
Pub Dt:
12/10/2009
Title:
SB-TE BASE ALLOY SINTER SPUTTERING TARGET
12
Patent #:
Issue Dt:
09/06/2011
Application #:
12445310
Filing Dt:
04/13/2009
Publication #:
Pub Dt:
04/08/2010
Title:
METHOD FOR COLLECTION OF VALUABLE METAL FROM ITO SCRAP
13
Patent #:
Issue Dt:
09/06/2011
Application #:
12445410
Filing Dt:
04/13/2009
Publication #:
Pub Dt:
04/08/2010
Title:
METHOD FOR COLLECTION OF VALUABLE METAL FROM ITO SCRAP
14
Patent #:
Issue Dt:
08/23/2011
Application #:
12445639
Filing Dt:
04/15/2009
Publication #:
Pub Dt:
12/16/2010
Title:
METHOD FOR COLLECTION OF VALUABLE METAL FROM ITO SCRAP
15
Patent #:
Issue Dt:
09/06/2011
Application #:
12445763
Filing Dt:
04/16/2009
Publication #:
Pub Dt:
11/25/2010
Title:
METHOD FOR COLLECTION OF VALUABLE METAL FROM ITO SCRAP
16
Patent #:
Issue Dt:
08/30/2011
Application #:
12445776
Filing Dt:
04/16/2009
Publication #:
Pub Dt:
08/05/2010
Title:
METHOD FOR COLLECTION OF VALUABLE METAL FROM ITO SCRAP
17
Patent #:
Issue Dt:
10/02/2012
Application #:
12521151
Filing Dt:
06/25/2009
Publication #:
Pub Dt:
01/28/2010
Title:
ROLL UNIT FOR USE IN SURFACE TREATMENT OF COPPER FOIL
18
Patent #:
Issue Dt:
07/12/2011
Application #:
12521167
Filing Dt:
06/25/2009
Publication #:
Pub Dt:
03/04/2010
Title:
ROLL UNIT DIPPED IN SURFACE TREATMENT LIQUID
19
Patent #:
NONE
Issue Dt:
Application #:
12522959
Filing Dt:
07/13/2009
Publication #:
Pub Dt:
01/21/2010
Title:
Sintered Silicon Wafer
20
Patent #:
Issue Dt:
07/10/2012
Application #:
12524623
Filing Dt:
07/27/2009
Publication #:
Pub Dt:
04/22/2010
Title:
COPPER ANODE OR PHOSPHOROUS-CONTAINING COPPER ANODE, METHOD OF ELECTROPLATING COPPER ON SEMICONDUCTOR WAFER, AND SEMICONDUCTOR WAFER WITH LOW PARTICLE ADHESION
21
Patent #:
Issue Dt:
04/01/2014
Application #:
12524947
Filing Dt:
07/29/2009
Publication #:
Pub Dt:
04/29/2010
Title:
METHOD OF RECOVERING VALUABLE METAL FROM SCRAP CONDUCTIVE OXIDE
22
Patent #:
Issue Dt:
05/27/2014
Application #:
12525113
Filing Dt:
07/30/2009
Publication #:
Pub Dt:
04/29/2010
Title:
METHOD OF RECOVERING VALUABLE METAL FROM SCRAP CONTAINING CONDUCTIVE OXIDE
23
Patent #:
Issue Dt:
04/01/2014
Application #:
12525450
Filing Dt:
07/31/2009
Publication #:
Pub Dt:
03/25/2010
Title:
Method of Recovering Valuable Metal from Scrap Containing Conductive Oxide
24
Patent #:
NONE
Issue Dt:
Application #:
12525871
Filing Dt:
08/05/2009
Publication #:
Pub Dt:
12/23/2010
Title:
Non-Adhesive-Type Flexible Laminate and Method for Production Thereof
25
Patent #:
Issue Dt:
05/03/2016
Application #:
12594492
Filing Dt:
10/02/2009
Publication #:
Pub Dt:
02/25/2010
Title:
Ytterbium Sputtering Target and Method of Producing said Target
26
Patent #:
NONE
Issue Dt:
Application #:
12596454
Filing Dt:
10/19/2009
Publication #:
Pub Dt:
06/03/2010
Title:
Electrolytic Copper Foil for Lithium Rechargeable Battery and Process for Producing the Copper Foil
27
Patent #:
Issue Dt:
10/04/2011
Application #:
12617966
Filing Dt:
11/13/2009
Publication #:
Pub Dt:
03/11/2010
Title:
SPUTTERING TARGET AND MANUFACTURING METHOD THEREOF
28
Patent #:
Issue Dt:
08/28/2012
Application #:
12666306
Filing Dt:
12/28/2009
Publication #:
Pub Dt:
07/29/2010
Title:
AMORPHOUS FILM OF COMPOSITE OXIDE, CRYSTALLINE FILM OF COMPOSITE OXIDE, METHOD OF PRODUCING SAID FILMS AND SINTERED COMPACT OF COMPOSITE OXIDE
29
Patent #:
NONE
Issue Dt:
Application #:
12666864
Filing Dt:
01/22/2010
Publication #:
Pub Dt:
08/05/2010
Title:
Spherical Copper Fine Powder and Process for Producing the Same
30
Patent #:
Issue Dt:
10/02/2012
Application #:
12668216
Filing Dt:
01/08/2010
Publication #:
Pub Dt:
06/10/2010
Title:
SINTERED COMPACT OF COMPOSITE OXIDE, AMORPHOUS FILM OF COMPOSITE OXIDE, PROCESS FOR PRODUCING SAID FILM, CRYSTALLINE FILM OF COMPOSITE OXIDE AND PROCESS FOR PRODUCING SAID FILM
31
Patent #:
NONE
Issue Dt:
Application #:
12668239
Filing Dt:
01/08/2010
Publication #:
Pub Dt:
12/30/2010
Title:
Sintered Silicon Wafer
32
Patent #:
NONE
Issue Dt:
Application #:
12668307
Filing Dt:
01/08/2010
Publication #:
Pub Dt:
07/29/2010
Title:
Sintered Silicon Wafer
33
Patent #:
NONE
Issue Dt:
Application #:
12676767
Filing Dt:
03/23/2010
Publication #:
Pub Dt:
08/19/2010
Title:
Method of Producing Sintered Compact, Sintered Compact, Sputtering Target Formed from the same, and Sputtering Target-Backing Plate Assembly
34
Patent #:
Issue Dt:
02/04/2014
Application #:
12679575
Filing Dt:
03/23/2010
Publication #:
Pub Dt:
08/26/2010
Title:
COPPER FOIL FOR PRINTED CIRCUIT AND COPPER-CLAD LAMINATE
35
Patent #:
NONE
Issue Dt:
Application #:
12738095
Filing Dt:
04/15/2010
Publication #:
Pub Dt:
08/26/2010
Title:
Metal Covered Polyimide Composite, Process for Producing the Composite, and Apparatus for Producing the Composite
36
Patent #:
Issue Dt:
10/29/2013
Application #:
12738098
Filing Dt:
04/15/2010
Publication #:
Pub Dt:
09/02/2010
Title:
METAL COVERED POLYIMIDE COMPOSITE, PROCESS FOR PRODUCING THE COMPOSITE, AND PROCESS FOR PRODUCING ELECTRONIC CIRCUIT BOARD
37
Patent #:
Issue Dt:
03/27/2012
Application #:
12738995
Filing Dt:
04/21/2010
Publication #:
Pub Dt:
10/14/2010
Title:
COPPER FOIL FOR PRINTED CIRCUIT BOARD AND COPPER CLAD LAMINATE FOR PRINTED CIRCUIT BOARD
38
Patent #:
Issue Dt:
03/11/2014
Application #:
12739011
Filing Dt:
04/21/2010
Publication #:
Pub Dt:
10/14/2010
Title:
High Purity Ytterbium, Sputtering Target Made Thereof, Thin Film Containing the Same, and Method of Producing the Same
39
Patent #:
Issue Dt:
10/29/2013
Application #:
12745278
Filing Dt:
05/28/2010
Publication #:
Pub Dt:
12/23/2010
Title:
SPUTTERING TARGET OF NONMAGNETIC-PARTICLE-DISPERSED FERROMAGNETIC MATERIAL
40
Patent #:
NONE
Issue Dt:
Application #:
12808469
Filing Dt:
06/16/2010
Publication #:
Pub Dt:
11/04/2010
Title:
Thin Film Mainly Comprising Titanium Oxide, Sintered Sputtering Target Suitable for Producing Thin Film Mainly Comprising Titanium Oxide, and Method of Producing Thin Film Mainly Comprising Titanium Oxide
41
Patent #:
Issue Dt:
06/25/2013
Application #:
12810160
Filing Dt:
06/23/2010
Publication #:
Pub Dt:
11/04/2010
Title:
METHOD OF PRODUCING TWO-LAYERED COPPER-CLAD LAMINATE, AND TWO-LAYERED COPPER-CLAD LAMINATE
42
Patent #:
Issue Dt:
03/17/2015
Application #:
12810319
Filing Dt:
06/24/2010
Publication #:
Pub Dt:
10/28/2010
Title:
High-Purity Lanthanum, Sputtering Target Comprising High-Purity Lanthanum, and Metal Gate Film Mainly Comprising High-Purity Lanthanum
43
Patent #:
Issue Dt:
08/28/2012
Application #:
12832120
Filing Dt:
07/08/2010
Publication #:
Pub Dt:
01/12/2012
Title:
HYBRID SILICON WAFER AND METHOD OF PRODUCING THE SAME
44
Patent #:
Issue Dt:
02/11/2014
Application #:
12832150
Filing Dt:
07/08/2010
Publication #:
Pub Dt:
01/12/2012
Title:
Hybrid Silicon Wafer and Method of Producing the Same
45
Patent #:
Issue Dt:
05/17/2011
Application #:
12861161
Filing Dt:
08/23/2010
Publication #:
Pub Dt:
12/09/2010
Title:
ELECTROLYTIC COPPER PLATING METHOD, PURE COPPER ANODE FOR ELECTROLYTIC COPPER PLATING, AND SEMICONDUCTOR WAFER HAVING LOW PARTICLE ADHESION PLATED WITH SAID METHOD AND ANODE
46
Patent #:
Issue Dt:
11/13/2012
Application #:
12863610
Filing Dt:
07/20/2010
Publication #:
Pub Dt:
11/18/2010
Title:
METHOD OF RECOVERING VALUABLE METALS FROM IZO SCRAP
47
Patent #:
Issue Dt:
11/13/2012
Application #:
12863656
Filing Dt:
07/20/2010
Publication #:
Pub Dt:
11/11/2010
Title:
METHOD OF RECOVERING VALUABLE METALS FROM IZO SCRAP
48
Patent #:
Issue Dt:
11/13/2012
Application #:
12863750
Filing Dt:
07/20/2010
Publication #:
Pub Dt:
11/18/2010
Title:
METHOD OF RECOVERING VALUABLE METALS FROM IZO SCRAP
49
Patent #:
Issue Dt:
06/02/2015
Application #:
12864553
Filing Dt:
07/26/2010
Publication #:
Pub Dt:
12/02/2010
Title:
Sintered Oxide Compact Target for Sputtering and Process for Producing the same
50
Patent #:
NONE
Issue Dt:
Application #:
12865885
Filing Dt:
08/03/2010
Publication #:
Pub Dt:
01/06/2011
Title:
Non-Adhesive Flexible Laminate
51
Patent #:
NONE
Issue Dt:
Application #:
12922485
Filing Dt:
09/14/2010
Publication #:
Pub Dt:
01/27/2011
Title:
Sintered Compact Target and Method of Producing Sintered Compact
Assignor
1
Exec Dt:
07/01/2010
Assignee
1
6-3, OTEMACHI 2-CHOME
CHIYODA-KU
TOKYO, JAPAN 100-8164
Correspondence name and address
WILLIAM BAK, HOWSON & HOWSON LLP
501 OFFICE CENTER DRIVE
SUITE 210
FORT WASHINGTON, PA 19034

Search Results as of: 05/03/2024 03:11 AM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT