Patent Assignment Details
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| Reel/Frame: | 025301/0697 | |
| Pages: | 3 |
| | Recorded: | 11/02/2010 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/20/2014
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Application #:
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12872966
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Filing Dt:
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08/31/2010
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Publication #:
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Pub Dt:
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03/31/2011
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND MULTILAYER WAFER STRUCTURE
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Assignees
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| 21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO-SHI |
| KYOTO 615-8585, JAPAN |
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| 1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA, 211-8668, JAPAN |
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Correspondence name and address
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RABIN & BERDO, P.C.
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1101 14TH STREET, N.W., SUITE 500
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WASHINGTON, DC 20005
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