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Reel/Frame:025375/0367   Pages: 7
Recorded: 11/16/2010
Attorney Dkt #:CS2009/046 (1016-157)
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/22/2013
Application #:
12947530
Filing Dt:
11/16/2010
Publication #:
Pub Dt:
05/17/2012
Title:
INTEGRATED CIRCUIT SYSTEM WITH BANDGAP MATERIAL AND METHOD OF MANUFACTURE THEREOF
Assignors
1
Exec Dt:
10/21/2010
2
Exec Dt:
10/21/2010
3
Exec Dt:
10/20/2010
4
Exec Dt:
10/21/2010
5
Exec Dt:
10/23/2010
Assignee
1
60 WOODLANDS INDUSTRIAL PARK D
STREET 2
SINGAPORE 738406, SINGAPORE
Correspondence name and address
MIKIO ISHIMARU
LAW OFFICES OF MIKIO ISHIMARU
333 W. EL CAMINO REAL, SUITE # 330
SUNNYVALE, CA 94087

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