Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 025389/0679 | |
| Pages: | 4 |
| | Recorded: | 11/18/2010 | | |
| Attorney Dkt #: | 086039-0085 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/26/2014
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Application #:
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12993401
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Filing Dt:
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02/01/2011
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Publication #:
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Pub Dt:
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05/26/2011
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Title:
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BONDING WIRE FOR SEMICONDUCTOR
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Assignees
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| 14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, |
| TOKYO, JAPAN 1010021 |
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| 158-1, OAZA SAYAMAGAHARA, IRUMA-SHI, |
| SAITAMA, JAPAN 3580032 |
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Correspondence name and address
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LOUIS J.DELJUIDICE
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MCDERMOTT WILL & EMERY LLP
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600 13TH STREET, N.W.
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WASHINGTON, DC 20005-3096
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