Patent Assignment Details
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| Reel/Frame: | 025436/0387 | |
| Pages: | 2 |
| | Recorded: | 12/02/2010 | | |
| Attorney Dkt #: | 919.0010 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/31/2012
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Application #:
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12958446
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Filing Dt:
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12/02/2010
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Publication #:
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Pub Dt:
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06/09/2011
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Title:
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ADHESIVE SHEET FOR A STEALTH DICING AND A PRODUCTION METHOD OF A SEMICONDUCTOR WAFER DEVICE
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Assignee
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| 23-23 HONCHO, ITABASHI-KU |
| TOKYO, JAPAN 173-0001 |
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Correspondence name and address
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CAHN & SAMUELS LLP
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1100 17TH STREET NW
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SUITE 401
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WASHINGTON, DC 20036
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