Patent Assignment Details
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| Reel/Frame: | 025487/0814 | |
| Pages: | 4 |
| | Recorded: | 12/09/2010 | | |
| Attorney Dkt #: | 27-766 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/12/2013
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Application #:
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12950631
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Filing Dt:
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11/19/2010
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Publication #:
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Pub Dt:
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05/24/2012
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACK INTERCONNECT AND METHOD OF MANUFACTURE THEREOF
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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LAW OFFICES OF MIKIO ISHIMARU
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333 W. EL CAMINO REAL
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SUITE 330
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SUNNYVALE, CA 94087
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