Patent Assignment Details
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| Reel/Frame: | 025505/0524 | |
| Pages: | 9 |
| | Recorded: | 12/15/2010 | | |
| Attorney Dkt #: | 2009_1376A |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/13/2014
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Application #:
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12449970
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Filing Dt:
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09/04/2009
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Publication #:
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Pub Dt:
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09/30/2010
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Title:
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SOLDER RESIST, DRY FILM THEREOF, CURED PRODUCT, AND PRINTED WIRING BOARD
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Assignee
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| 7-1, HAZAWA 2-CHOME, NERIMA-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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1030 15TH STREET, N.W.
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SUITE 400 EAST
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WASHINGTON, DC 20009
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