Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 025546/0085 | |
| Pages: | 2 |
| | Recorded: | 12/21/2010 | | |
| Attorney Dkt #: | 065933-0501 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/01/2013
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Application #:
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12935864
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Filing Dt:
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12/21/2010
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Publication #:
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Pub Dt:
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06/02/2011
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Title:
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SOLDER STRUCTURE, METHOD FOR FORMING THE SOLDER STRUCTURE, AND SEMICONDUCTOR MODULE INCLUDING THE SOLDER STRUCTURE
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Assignee
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| 5-5, KEIHAN-HONDORI 2-CHOME, MORIGUCHI CITY |
| OSAKA, JAPAN 570-8677 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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600 13TH STREET, N.W.
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WASHINGTON, DC 20005-3096
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