Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 025656/0253 | |
| Pages: | 3 |
| | Recorded: | 01/18/2011 | | |
Attorney Dkt #: | P3565US00 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
06/17/2014
|
Application #:
|
13008845
|
Filing Dt:
|
01/18/2011
|
Publication #:
|
|
Pub Dt:
|
07/19/2012
| | | | |
Title:
|
FORMING THROUGH-SILICON-VIAS FOR MULTI-WAFER INTEGRATED CIRCUITS
|
|
Assignee
|
|
|
3/F, BUILDING 6 |
2 SCIENCE PARK WEST AVENUE |
SHATIN, NEW TERRITORIES, HONG KONG |
|
Correspondence name and address
|
|
ELLA CHEONG HONG KONG
|
|
5001 HOPEWELL CENTRE, 183 QUEEN'S ROAD E
|
|
WAN CHAI, HONG KONG
|
Search Results as of:
05/11/2024 04:25 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|