Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 025888/0409 | |
| Pages: | 5 |
| | Recorded: | 03/02/2011 | | |
| Attorney Dkt #: | 10-046-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/26/2013
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Application #:
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13012275
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Filing Dt:
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01/24/2011
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Publication #:
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Pub Dt:
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07/28/2011
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Title:
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Thin Film Wafer Level Package
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Assignees
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| KAPELDREEF 75 |
| LEUVEN, BELGIUM 3001 |
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| MINDERBROEDERSSTRAAT 8A |
| BUS 5105 |
| LEUVEN, BELGIUM 3000 |
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Correspondence name and address
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MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP
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300 SOUTH WACKER DRIVE
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CHICAGO, IL 60606
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