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Reel/Frame:025933/0628   Pages: 3
Recorded: 03/10/2011
Attorney Dkt #:058546.00066
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
13044876
Filing Dt:
03/10/2011
Publication #:
Pub Dt:
12/15/2011
Title:
PACKAGING STRUCTURE, PRINTED CIRCUIT BOARD ASSEMBLY AND FIXING METHOD
Assignors
1
Exec Dt:
01/25/2011
2
Exec Dt:
01/25/2011
3
Exec Dt:
01/25/2011
4
Exec Dt:
01/25/2011
Assignee
1
1-1, KAMIKODANAKA 4-CHOME
NAKAHARA-KU
KAWASAKI-SHI, KANAGAWA, JAPAN 211-8588
Correspondence name and address
SQUIRE, SANDERS & DEMPSEY (US) LLP
8000 TOWERS CRESCENT DRIVE
14TH FLOOR
VIENNA, VA 22182-6212

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