Patent Assignment Details
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| Reel/Frame: | 025977/0914 | |
| Pages: | 2 |
| | Recorded: | 03/17/2011 | | |
| Attorney Dkt #: | SUT-0529 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13050882
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Filing Dt:
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03/17/2011
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Publication #:
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Pub Dt:
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09/29/2011
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Title:
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SEMICONDUCTOR WAFER MOUNTING METHOD AND SEMICONDUCTOR WAFER MOUNTING APPARATUS
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Assignee
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| 1-2, SHIMOHOZUMI 1-CHOME |
| IBARAKI-SHI, OSAKA, JAPAN 567-8680 |
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Correspondence name and address
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LEE CHENG
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1100 17TH STREET N.W. STE 503
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WASHINGTON, DC 20036
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