Patent Assignment Details
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| Reel/Frame: | 026018/0589 | |
| Pages: | 2 |
| | Recorded: | 03/24/2011 | | |
| Attorney Dkt #: | SOEI0078 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/18/2014
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Application #:
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12838291
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Filing Dt:
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07/16/2010
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Publication #:
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Pub Dt:
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01/19/2012
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Title:
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SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING FILM-FORM ADHESIVE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
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Assignee
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| 1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU |
| TOKYO, JAPAN 163-0449 |
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Correspondence name and address
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GRIFFIN & SZIPL, PC
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SUITE PH-1
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2300 NINTH STREET, SOUTH
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ARLINGTON, VA 22204
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