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Reel/Frame:026025/0515   Pages: 3
Recorded: 03/25/2011
Attorney Dkt #:AMDI:245\\HON
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/11/2014
Application #:
13072554
Filing Dt:
03/25/2011
Publication #:
Pub Dt:
09/27/2012
Title:
METHOD OF FABRICATING A SEMICONDUCTOR CHIP WITH SUPPORTIVE TERMINAL PAD
Assignor
1
Exec Dt:
03/23/2011
Assignee
1
ONE AMD PLACE, PO BOX 3453
KEVIN A. O'NEIL
SUNNYVALE, CALIFORNIA 94088-3453
Correspondence name and address
TIMOTHY M. HONEYCUTT
PO BOX 1577
CYPRESS, TX 77410-1577

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