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Reel/Frame:026036/0419   Pages: 6
Recorded: 03/29/2011
Attorney Dkt #:MIM0017US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/26/2013
Application #:
12942437
Filing Dt:
11/09/2010
Publication #:
Pub Dt:
05/10/2012
Title:
HIGH MELTING POINT SOLDERING LAYER ALLOYED BY TRANSIENT LIQUID PHASE AND FABRICATION METHOD FOR THE SAME, AND SEMICONDUCTOR DEVICE
Assignors
1
Exec Dt:
12/22/2010
2
Exec Dt:
12/23/2010
3
Exec Dt:
02/01/2011
Assignees
1
21 SAIIN MIZOSAKI-CHO
UKYO-KU, KYOTO-SHI
KYOTO-FU, JAPAN
2
2404 NORTH UNIVERSITY AVENUE
LITTLE ROCK, ARKANSAS 72207
Correspondence name and address
CANTOR COLBURN LLP
20 CHURCH STREET
22ND FLOOR
HARTFORD, CT 06103

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