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Reel/Frame:026062/0096   Pages: 3
Recorded: 04/01/2011
Attorney Dkt #:002778/0008
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/26/2013
Application #:
13009949
Filing Dt:
01/20/2011
Publication #:
Pub Dt:
07/28/2011
Title:
METHOD OF FABRICATING AN INTEGRATED CIRCUIT PACKAGE
Assignor
1
Exec Dt:
03/30/2011
Assignee
1
2 DASHWOOD LANG ROAD
ADDLESTONE, NR WEYBRIDGE
SURREY, UNITED KINGDOM KT152NX
Correspondence name and address
PIERRE R. YANNEY, ESQ.
180 MAIDEN LANE
STROOCK & STROOCK & LAVAN LLP
NEW YORK, NY 10038

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