Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 026063/0687 | |
| Pages: | 4 |
| | Recorded: | 04/01/2011 | | |
| Attorney Dkt #: | 27-626 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/21/2014
|
Application #:
|
13052590
|
Filing Dt:
|
03/21/2011
|
|
Publication #:
|
|
Pub Dt:
|
09/27/2012
| | | | |
|
Title:
|
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STEP MOLD AND METHOD OF MANUFACTURE THEREOF
|
|
|
Assignee
|
|
|
|
|
| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
|
|
Correspondence name and address
|
| |
LAW OFFICES OF MIKIO ISHIMARU
|
| |
333 W. EL CAMINO REAL
|
| |
SUITE 330
|
| |
SUNNYVALE, CA 94087
|
Search Results as of:
05/15/2024 08:22 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
