Patent Assignment Details
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| Reel/Frame: | 026075/0765 | |
| Pages: | 19 |
| | Recorded: | 04/05/2011 | | |
| Attorney Dkt #: | 8734.314.D1 |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/12/2011
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Application #:
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12718724
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Filing Dt:
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03/05/2010
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Publication #:
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Pub Dt:
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06/24/2010
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Title:
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ETCHANT FOR ETCHING DOUBLE-LAYERED COPPER STRUCTURE AND METHOD OF FORMING ARRAY SUBSTRATE HAVING DOUBLE-LAYERED COPPER STRUCTURES
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Assignee
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| 20, YOIDO-DONG, YOUNGDUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF |
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Correspondence name and address
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MCKENNA LONG & ALDRIDGE LLP
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1900 K STREET NW
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WASHINGTON, DC 20006
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