Patent Assignment Details
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| Reel/Frame: | 026104/0850 | |
| Pages: | 3 |
| | Recorded: | 04/11/2011 | | |
| Attorney Dkt #: | 2011_0570A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/07/2013
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Application #:
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13123585
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Filing Dt:
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04/11/2011
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Publication #:
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Pub Dt:
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08/18/2011
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Title:
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STORING PACKAGE UNIT AND A STORING METHOD FOR MICRO SOLDER SPHERES
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Assignee
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| 23, SENJU HASHIDO-CHO, ADACHI-KU, |
| TOKYO, JAPAN 120-8555 |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, LLP
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1030 15TH STREET, N.W.
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SUITE 400 EAST
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WASHINGTON, DC 20005
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