skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Details
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:026151/0894   Pages: 3
Recorded: 04/19/2011
Attorney Dkt #:10-TPY-094 (851663.520)
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
12/31/2013
Application #:
12982697
Filing Dt:
12/30/2010
Publication #:
Pub Dt:
07/05/2012
Title:
THROUGH HOLE VIA FILLING USING ELECTROLESS PLATING
Assignors
1
Exec Dt:
01/05/2011
2
Exec Dt:
01/05/2011
3
Exec Dt:
01/05/2011
4
Exec Dt:
01/05/2011
Assignee
1
28 ANG MO KIO INDUSTRIAL PARK 2
SINGAPORE, SINGAPORE 569508
Correspondence name and address
DAVID C. CONLEE
701 FIFTH AVENUE
SUITE 5400
SEATTLE, WA 98104

Search Results as of: 05/13/2024 11:03 AM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT