Patent Assignment Details
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Reel/Frame: | 026217/0562 | |
| Pages: | 2 |
| | Recorded: | 04/29/2011 | | |
Attorney Dkt #: | 147798 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/18/2014
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Application #:
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12960921
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Filing Dt:
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12/06/2010
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Publication #:
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Pub Dt:
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06/07/2012
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Title:
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METHOD OF MANUFACTURING LAYERED CHIP PACKAGE
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Assignees
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678 S. HILLVIEW DR. |
MILPITAS, CALIFORNIA 95035 U.S.A. |
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SAE TECHNOLOGY CENTRE, |
6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK |
SHATIN, N.T., HONG KONG, CHINA |
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Correspondence name and address
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JAMES A. OLIFF
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OLIFF & BERRIDGE, PLC
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P.O. BOX 320850
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ALEXANDRIA, VA 22320-4850
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