Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 026268/0344 | |
| Pages: | 19 |
| | Recorded: | 05/12/2011 | | |
| Attorney Dkt #: | 5152-488 |
| Conveyance: | MERGER (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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12/03/2002
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Application #:
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09384226
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Filing Dt:
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08/27/1999
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Title:
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SOLDERING PASTE, SOLDERING METHOD, AND SURFACE-MOUNTED TYPE ELECTRONIC DEVICE
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Patent #:
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Issue Dt:
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09/14/2004
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Application #:
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10147171
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Filing Dt:
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05/13/2002
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Publication #:
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Pub Dt:
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12/26/2002
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Title:
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SOLDER WORK MATERIAL FOR FORMING SOLDER-COATED CIRCUIT BOARD AND CIRCUIT BOARD
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Assignee
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| 1-19-43, HIGASHI-OIZUMI, NERIMA-KU |
| TOKYO, JAPAN 178-8511 |
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Correspondence name and address
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THILO C. AGTHE
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100 WALL STREET, 21ST FLOOR
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NEW YORK, NY 10005
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