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Total properties:
30
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Patent #:
|
|
Issue Dt:
|
05/10/1994
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Application #:
|
08003539
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Filing Dt:
|
01/13/1993
|
|
Title:
|
METHOD FOR FIXING SEMICONDUCTOR BODIES ON A SUBSTRATE USING WIRES
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|
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Patent #:
|
|
Issue Dt:
|
06/30/1998
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Application #:
|
08005760
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Filing Dt:
|
01/19/1993
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|
Title:
|
POWER DIODE
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|
|
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Patent #:
|
|
Issue Dt:
|
04/05/1994
|
Application #:
|
08022878
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Filing Dt:
|
02/25/1993
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Title:
|
SEMICONDUCTOR COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF
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|
|
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Patent #:
|
|
Issue Dt:
|
07/25/1995
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Application #:
|
08327220
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Filing Dt:
|
10/21/1994
|
|
Title:
|
SEMICONDUCTOR COMPONENT AND METHOD FOR THE MANUFACTURING THEREOF
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|
|
|
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Patent #:
|
|
Issue Dt:
|
04/16/1996
|
Application #:
|
08336319
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Filing Dt:
|
11/08/1994
|
|
Title:
|
SEMICONDUCTOR MODULE
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|
|
|
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Patent #:
|
|
Issue Dt:
|
03/28/2000
|
Application #:
|
08940471
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Filing Dt:
|
09/30/1997
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|
Title:
|
SEMICONDUCTOR COMPONENT WITH SCATTERING CENTERS WITHIN A LATERAL RESISTOR REGION
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|
|
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Patent #:
|
|
Issue Dt:
|
04/16/2002
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Application #:
|
09281692
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Filing Dt:
|
03/30/1999
|
|
Title:
|
THYRISTOR WITH BREAKDOWN REGION
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/06/2004
|
Application #:
|
09789341
|
Filing Dt:
|
02/20/2001
|
|
Publication #:
|
|
Pub Dt:
|
09/20/2001
| | | | |
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Title:
|
SUBSTRATE FOR POWER SEMICONDUCTOR MODULES WITH THROUGH-PLATING OF SOLDER AND METHOD FOR ITS PRODUCTION
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|
|
|
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Patent #:
|
|
Issue Dt:
|
08/13/2002
|
Application #:
|
09793352
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Filing Dt:
|
02/26/2001
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|
Publication #:
|
|
Pub Dt:
|
10/18/2001
| | | | |
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Title:
|
SPRING CLIP FOR FIXING SEMICONDUCTOR MODULES TO A HEAT SINK
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|
|
|
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Patent #:
|
|
Issue Dt:
|
11/19/2002
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Application #:
|
09793793
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Filing Dt:
|
02/26/2001
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|
Publication #:
|
|
Pub Dt:
|
10/04/2001
| | | | |
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Title:
|
CONNECTING DEVICE FOR POWER SEMICONDUCTOR MODULES WITH COMPENSATION FOR MECHANICAL STRESSES
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|
|
|
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Patent #:
|
|
Issue Dt:
|
12/09/2003
|
Application #:
|
09830326
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Filing Dt:
|
07/02/2001
|
|
Title:
|
METHOD FOR PRODUCING A POWER SEMICONDUCTOR DEVICE WITH A STOP ZONE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/04/2003
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Application #:
|
09894679
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Filing Dt:
|
06/28/2001
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|
Publication #:
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Pub Dt:
|
01/10/2002
| | | | |
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Title:
|
MULTICHIP CONFIGURATION
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|
|
|
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Patent #:
|
|
Issue Dt:
|
07/22/2003
|
Application #:
|
09954411
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Filing Dt:
|
09/17/2001
|
|
Publication #:
|
|
Pub Dt:
|
03/21/2002
| | | | |
|
Title:
|
POWER SEMICONDUCTOR MODULE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/26/2004
|
Application #:
|
10023189
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Filing Dt:
|
12/17/2001
|
|
Publication #:
|
|
Pub Dt:
|
07/11/2002
| | | | |
|
Title:
|
LOW-INDUCTANCE SEMICONDUCTOR COMPONENTS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/17/2004
|
Application #:
|
10074605
|
Filing Dt:
|
02/12/2002
|
|
Publication #:
|
|
Pub Dt:
|
09/05/2002
| | | | |
|
Title:
|
LATERAL SEMICONDUCTOR COMPONENT IN THIN-FILM SOI TECHNOLOGY
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|
|
|
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Patent #:
|
|
Issue Dt:
|
03/01/2005
|
Application #:
|
10277126
|
Filing Dt:
|
10/21/2002
|
|
Publication #:
|
|
Pub Dt:
|
06/05/2003
| | | | |
|
Title:
|
CIRCUIT CONFIGURATION
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/12/2004
|
Application #:
|
10298395
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Filing Dt:
|
11/18/2002
|
|
Publication #:
|
|
Pub Dt:
|
04/24/2003
| | | | |
|
Title:
|
HOUSING DEVICE AND CONTACT ELEMENT TO BE USED IN THE HOUSING DEVICE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/28/2004
|
Application #:
|
10298396
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Filing Dt:
|
11/18/2002
|
|
Publication #:
|
|
Pub Dt:
|
05/08/2003
| | | | |
|
Title:
|
POWER SEMICONDUCTOR MODULE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/22/2005
|
Application #:
|
10308049
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Filing Dt:
|
12/02/2002
|
|
Publication #:
|
|
Pub Dt:
|
06/19/2003
| | | | |
|
Title:
|
SUBSTRATE FOR RECEIVING A CIRCUIT CONFIGURATION AND METHOD FOR PRODUCING THE SUBSTRATE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/13/2005
|
Application #:
|
10372988
|
Filing Dt:
|
02/24/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/14/2003
| | | | |
|
Title:
|
INSULATING ELEMENT
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/09/2004
|
Application #:
|
10377071
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Filing Dt:
|
02/28/2003
|
|
Publication #:
|
|
Pub Dt:
|
07/24/2003
| | | | |
|
Title:
|
BODY OF A SEMICONDUCTOR MATERIAL WITH A REDUCED MEAN FREE PATH LENGTH
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/05/2005
|
Application #:
|
10393165
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Filing Dt:
|
03/20/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/21/2003
| | | | |
|
Title:
|
CONTROLLABLE SEMICONDUCTOR COMPONENT WITH MULTI-SECTION CONTROL ELECTRODE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/07/2004
|
Application #:
|
10429605
|
Filing Dt:
|
05/05/2003
|
|
Publication #:
|
|
Pub Dt:
|
09/11/2003
| | | | |
|
Title:
|
POWER SEMICONDUCTOR MODULE WITH CERAMIC SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/18/2006
|
Application #:
|
10742366
|
Filing Dt:
|
12/19/2003
|
|
Publication #:
|
|
Pub Dt:
|
07/22/2004
| | | | |
|
Title:
|
HIGH VOLTAGE MODULE AND METHOD FOR PRODUCING SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/08/2005
|
Application #:
|
10797246
|
Filing Dt:
|
03/10/2004
|
|
Publication #:
|
|
Pub Dt:
|
09/02/2004
| | | | |
|
Title:
|
SEMICONDUCTOR COMPONENT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/10/2006
|
Application #:
|
10953099
|
Filing Dt:
|
09/29/2004
|
|
Publication #:
|
|
Pub Dt:
|
02/24/2005
| | | | |
|
Title:
|
CIRCUIT ARRANGEMENT FOR CONTROL OF A SEMICONDUCTOR CIRCUIT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/01/2007
|
Application #:
|
10978930
|
Filing Dt:
|
11/01/2004
|
|
Publication #:
|
|
Pub Dt:
|
04/14/2005
| | | | |
|
Title:
|
HALF-BRIDGE CIRCUIT WITH PHASE OUTPUT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/22/2007
|
Application #:
|
11206887
|
Filing Dt:
|
08/18/2005
|
|
Publication #:
|
|
Pub Dt:
|
02/23/2006
| | | | |
|
Title:
|
SEMICONDUCTOR MODULE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/15/2008
|
Application #:
|
11221112
|
Filing Dt:
|
09/06/2005
|
|
Publication #:
|
|
Pub Dt:
|
03/16/2006
| | | | |
|
Title:
|
BONDING WIRE AND BONDED CONNECTION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/12/2006
|
Application #:
|
11234902
|
Filing Dt:
|
09/26/2005
|
|
Publication #:
|
|
Pub Dt:
|
03/30/2006
| | | | |
|
Title:
|
CONNECTION PART AND METHOD FOR PRODUCING A CONNECTION PART
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|
