Patent Assignment Details
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| Reel/Frame: | 026396/0511 | |
| Pages: | 5 |
| | Recorded: | 06/06/2011 | | |
| Attorney Dkt #: | MI22-4761 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/07/2014
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Application #:
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13154132
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Filing Dt:
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06/06/2011
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Publication #:
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Pub Dt:
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12/06/2012
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Title:
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Methods of Forming Through-Substrate Interconnects
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Assignee
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| 8000 SOUTH FEDERAL WAY |
| MS 1-525 |
| BOISE, IDAHO 83716 |
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Correspondence name and address
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WELLS ST. JOHN P.S.
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601 W. 1ST STREET #1300
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SPOKANE, WA 99201
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