Patent Assignment Details
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| Reel/Frame: | 026403/0788 | |
| Pages: | 2 |
| | Recorded: | 06/07/2011 | | |
| Attorney Dkt #: | O11.2-15269-US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13080215
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Filing Dt:
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04/05/2011
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Publication #:
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Pub Dt:
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10/13/2011
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Title:
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METHOD OF POLISHING WAFER SURFACE ON WHICH COPPER AND SILICON ARE EXPOSED
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Assignee
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| 1-1, CHIRYO 2-CHOME, NISHIBIWAJIMA-CHO |
| KIYOSU-SHI, JAPAN AICHI 452-8502 |
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Correspondence name and address
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SCOTT Q. VIDAS
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6640 SHADY OAK ROAD
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SUITE 400
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EDEN PRAIRIE, MN 55344
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