Patent Assignment Details
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| Reel/Frame: | 026416/0502 | |
| Pages: | 3 |
| | Recorded: | 06/09/2011 | | |
| Attorney Dkt #: | 2011-020USORG |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13156509
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Filing Dt:
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06/09/2011
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Publication #:
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Pub Dt:
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12/13/2012
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Title:
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PACKAGED DEVICE INCLUDING INTERPOSER FOR INCREASED ADHESIVE THICKNESS AND METHOD OF ATTACHING DIE TO SUBSTRATE
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Assignee
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| NO. 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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Correspondence name and address
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AVAGO TECHNOLOGIES, LTD.
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4380 ZIEGLER ROAD
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FORT COLLINS, CO 80525
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