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Patent #:
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Issue Dt:
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01/31/1995
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Application #:
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07860810
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Filing Dt:
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03/31/1992
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Title:
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LEADFRAME HAVING ONE OR MORE POWER/GROUND PLANES WITHOUT VIAS
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Patent #:
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Issue Dt:
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01/24/1995
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Application #:
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08058120
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Filing Dt:
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05/05/1993
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Title:
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OFF-AXIS POWER BRANCHES FOR INTERIOR BOND PAD ARRANGEMENTS
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Patent #:
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Issue Dt:
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01/07/1997
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Application #:
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08144981
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Filing Dt:
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10/28/1993
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Title:
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SOLDER BALL INTERCONNECTED ASSEMBLY
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Patent #:
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Issue Dt:
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10/08/1996
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Application #:
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08187238
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Filing Dt:
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01/25/1994
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Title:
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SURFACE MOUNT PERIPHERAL LEADED AND BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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01/30/1996
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Application #:
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08342533
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Filing Dt:
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11/21/1994
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Title:
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A METHOD FOR MAKING PRINTED CIRCUIT BOARDS WITH SELECTIVELY FILLED PLATED THROUGH HOLES
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Patent #:
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Issue Dt:
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07/01/1997
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Application #:
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08377211
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Filing Dt:
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01/23/1995
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Title:
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PROCESS FOR MANUFACTURING OFF-AXIS POWER BRANCHES FOR INTERIOR BOND PAD ARRANGEMENTS
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Patent #:
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Issue Dt:
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03/18/1997
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Application #:
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08387024
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Filing Dt:
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02/10/1995
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Title:
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METHOD OF FORMING ELECTRICALLY CONDUCTIVE POLYMER INTERCONNECTS ON ELECTRICAL SUBSTRATES
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Patent #:
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Issue Dt:
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02/06/1996
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Application #:
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08387155
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Filing Dt:
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02/10/1995
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Title:
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SEMICONDUCTOR DEVICE HAVING AN UNIVERSAL DIE SIZE INNER LEAD LAYOUT
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Patent #:
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Issue Dt:
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08/13/1996
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Application #:
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08396084
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Filing Dt:
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02/28/1995
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Title:
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SEMICONDUCTOR DEVICE ASSEMBLY WITH MINIMIZED BOND FINGER CONNECTIONS
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Patent #:
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Issue Dt:
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10/08/1996
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Application #:
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08443064
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Filing Dt:
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05/17/1995
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Title:
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APPARATUS FOR MOUNTING INTEGRATED CIRCUIT CHIPS ON A MINI-BOARD
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Patent #:
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Issue Dt:
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09/24/1996
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Application #:
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08463344
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Filing Dt:
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06/05/1995
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Title:
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METHOD OF PREPARING A PRINTED CIRCUIT BOARD
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Patent #:
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Issue Dt:
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10/22/1996
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Application #:
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08469086
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Filing Dt:
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06/05/1995
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Title:
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METHOD FOR FORMING INTERIOR BOND PADS HAVING ZIG-ZAG LINEAR ARRANGE- MENT
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Patent #:
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Issue Dt:
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10/14/1997
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Application #:
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08474343
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Filing Dt:
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06/07/1995
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Title:
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SOLDER BALL CONNECTIONS AND ASSEMBLY PROCESS
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Patent #:
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Issue Dt:
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03/09/1999
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Application #:
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08503622
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Filing Dt:
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07/18/1995
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Title:
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METHOD FOR FORMING ELECTRICALLY CONDUCTIVE POLYMER INTERCONNECTS ON ELECTRICAL SUBSTRATES
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Patent #:
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Issue Dt:
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05/26/1998
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Application #:
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08516614
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Filing Dt:
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08/18/1995
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Title:
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PROCESS FOR FORMING METAL INTERCONNECT STRUCTURES FOR USE WITH INTEGRATED CIRCUIT DEVICES TO FORM INTEGRATED CIRCUIT STRUCTURES
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Patent #:
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Issue Dt:
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07/21/1998
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Application #:
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08554111
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Filing Dt:
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11/06/1995
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Title:
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ARRANGEMENT OF PADS AND THROUGH-HOLES FOR SEMICONDUCTOR PACKAGES
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Patent #:
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Issue Dt:
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08/12/1997
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Application #:
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08585819
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Filing Dt:
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01/16/1996
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Title:
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ELECTROPLATING APPARATUS
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Patent #:
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Issue Dt:
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03/24/1998
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Application #:
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08612614
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Filing Dt:
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03/06/1996
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Title:
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LEAD-FREE, TIN-BASED MULTI-COMPONENT SOLDER ALLOYS
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Patent #:
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Issue Dt:
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09/30/1997
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Application #:
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08633322
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Filing Dt:
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04/17/1996
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Title:
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PROCESS FOR SELECTIVE APPLICATION OF SOLDER TO CIRCUIT PACKAGES
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Patent #:
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Issue Dt:
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12/29/1998
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Application #:
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08638898
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Filing Dt:
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04/24/1996
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Title:
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MULTI-LAYER TAB TAPE HAVING DISTINCT SIGNAL, POWER AND GROUND PLANES, SEMICONDUCTOR DEVICE ASSEMBLY EMPLOYING SAME, APPARATUS FOR AND METHOD OF ASSEMBLING SAME
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Patent #:
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Issue Dt:
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01/07/2003
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Application #:
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08640645
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Filing Dt:
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05/01/1996
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Title:
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SOLDER BALL CONNECTIONS AND ASSEMBLY PROCESS
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Patent #:
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Issue Dt:
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09/29/1998
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Application #:
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08660490
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Filing Dt:
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06/07/1996
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Title:
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SEMICONDUCTOR DIE WITH STAGGERED BOND PADS
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Patent #:
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Issue Dt:
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08/18/1998
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Application #:
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08712981
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Filing Dt:
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09/16/1996
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Title:
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PROGRESSIVE STAGGERED BONDING PADS
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Patent #:
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Issue Dt:
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06/23/1998
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Application #:
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08718120
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Filing Dt:
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09/18/1996
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Title:
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SOCKET FOR SEMI-PERMANENTLY CONNECTING A SOLDER BALL GRID ARRAY DEVICE USING A DENDRITE INTERPOSER
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Patent #:
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Issue Dt:
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08/04/1998
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Application #:
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08725735
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Filing Dt:
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10/04/1996
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Title:
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SURFACE MOUNT PERIPHERAL LEADED AND BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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03/24/1998
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Application #:
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08768966
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Filing Dt:
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12/18/1996
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Title:
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CHIP ON BOARD PACKAGE WITH TOP AND BOTTOM TERMINALS
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Patent #:
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Issue Dt:
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10/06/1998
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Application #:
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08785187
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Filing Dt:
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01/17/1997
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Title:
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CHIP STACKING BY EDGE METALLIZATION
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Patent #:
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Issue Dt:
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05/02/2000
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Application #:
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08794272
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Filing Dt:
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01/31/1997
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Title:
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FACE ON FACE FLIP CLIP INTEGRATION
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Patent #:
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Issue Dt:
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07/06/1999
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Application #:
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08818634
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Filing Dt:
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03/14/1997
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Title:
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METHOD OF FORMING ELECTRICALLY CONDUCTIVE POLYMER INTERCONNECTS ON ELECTRICAL SUBSTRATES
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Patent #:
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Issue Dt:
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01/12/1999
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Application #:
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08839052
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Filing Dt:
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04/23/1997
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Title:
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REFLOW BALL GRID ARRAY ASSEMBLY
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Patent #:
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Issue Dt:
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02/09/1999
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Application #:
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08840614
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Filing Dt:
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04/21/1997
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Title:
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THIN POWER TAPE BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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10/20/1998
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Application #:
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08849578
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Filing Dt:
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06/03/1997
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Title:
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ELECTRONIC PACKAGE WITH ENHANCED PAD DESIGN
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Patent #:
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Issue Dt:
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05/09/2000
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Application #:
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08882458
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Filing Dt:
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06/25/1997
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Title:
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METHOD FOR ESTABLISHING ELECTRICAL COMMUNICATION BETWEEN A FIRST OBJECT HAVING A SOLDER BALL AND A SECOND OBJECT
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Patent #:
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Issue Dt:
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08/04/1998
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Application #:
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08883112
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Filing Dt:
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06/26/1997
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Title:
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BARE DIE MULTIPLE DIES FOR DIRECT ATTACH
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Patent #:
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Issue Dt:
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10/26/1999
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Application #:
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08932711
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Filing Dt:
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09/17/1997
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Title:
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INTERPOSER FOR BALL GRID ARRAY (BGA) PACKAGE
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Patent #:
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Issue Dt:
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12/28/1999
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Application #:
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09006813
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Filing Dt:
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01/14/1998
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Title:
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INTEGRATED CIRCUIT PACKAGE HAVING SIGNAL TRACES INTERPOSED BETWEEN POWER AND GROUND CONDUCTORS IN ORDER TO FORM STRIPLINE TRANSMISSION LINES
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Patent #:
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Issue Dt:
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03/13/2001
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Application #:
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09010414
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Filing Dt:
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01/21/1998
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Title:
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LOW COST THERMALLY ENHANCED FLIP CHIP BGA
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Patent #:
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Issue Dt:
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07/06/2004
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Application #:
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09017338
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Filing Dt:
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02/02/1998
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Title:
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WIRE BONDING TO DUAL METAL COVERED PAD SURFACES
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Patent #:
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Issue Dt:
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03/27/2001
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Application #:
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09033505
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Filing Dt:
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03/02/1998
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Title:
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LAMINATE AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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Issue Dt:
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03/06/2001
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Application #:
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09047984
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Filing Dt:
|
03/25/1998
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Title:
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FULL ADDITIVE PROCESS WITH FILLED PLATED THROUGH HOLES
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Patent #:
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|
Issue Dt:
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09/19/2000
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Application #:
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09120172
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Filing Dt:
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07/21/1998
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Title:
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SEMICONDUCTOR FLIP-CHIP PACKAGE AND METHOD FOR THE FABRICATION THEREOF
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Patent #:
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Issue Dt:
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10/02/2001
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Application #:
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09137971
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Filing Dt:
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08/21/1998
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Title:
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SEMICONDUCTOR FLIP-CHIP ASSEMBLY WITH PRE-APPLIED ENCAPSULATING LAYERS
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Patent #:
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Issue Dt:
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09/17/2002
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Application #:
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09159360
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Filing Dt:
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09/23/1998
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Title:
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METHOD OF PREPARING A PRINTED CIRCUIT BOARD
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Patent #:
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|
Issue Dt:
|
08/01/2000
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Application #:
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09171455
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Filing Dt:
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10/19/1998
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Title:
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Semiconductor Device Having Magnetic Shield Layer Circumscribing The Device
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Patent #:
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|
Issue Dt:
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03/20/2001
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Application #:
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09172299
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Filing Dt:
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10/14/1998
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Title:
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PULSE REVERSE ELECTRODEPOSITION FOR METALLIZATION AND PLANARIZATION OF SEMICONDUCTOR SUBSTRATES
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Patent #:
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Issue Dt:
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09/18/2001
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Application #:
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09185425
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Filing Dt:
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11/03/1998
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Title:
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THERMAL DEFORMATION MANAGEMENT FOR CHIP CARRIERS
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Patent #:
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Issue Dt:
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04/03/2001
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Application #:
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09239811
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Filing Dt:
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01/29/1999
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Title:
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ELECTRODEPOSITION OF METALS IN SMALL RECESSES FOR MANUFACTURE OF HIGH DENSITY INTERCONNECTS USING REVERSE PULS PLATING
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Patent #:
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Issue Dt:
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10/31/2000
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Application #:
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09264396
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Filing Dt:
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03/08/1999
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Title:
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METHOD OF FORMING ELECTRICALLY CONDUCTIVE POLYMER INTERCONNECTS ON ELECTRICAL SUBSTRATES
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Patent #:
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Issue Dt:
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03/27/2001
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Application #:
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09284614
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Filing Dt:
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06/24/1999
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Title:
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MEMORY MODULE
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Patent #:
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Issue Dt:
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05/21/2002
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Application #:
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09287370
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Filing Dt:
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04/07/1999
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Title:
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HYBRID MOLDS FOR MOLTEN SOLDER SCREENING PROCESS
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Patent #:
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Issue Dt:
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06/24/2003
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Application #:
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09300783
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Filing Dt:
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04/27/1999
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Publication #:
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Pub Dt:
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04/25/2002
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Title:
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METHOD OF REFORMING REFORMABLE MEMBERS OF AN ELECTRONIC PACKAGE AND THE RESULTANT ELECTRONIC PACKAGE
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Patent #:
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Issue Dt:
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01/29/2002
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Application #:
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09301890
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Filing Dt:
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04/29/1999
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Title:
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METHOD FOR DIRECT CHIP ATTACH BY SOLDER BUMPS AND AN UNDERFILL LAYER
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Patent #:
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Issue Dt:
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10/17/2000
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Application #:
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09314003
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Filing Dt:
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05/19/1999
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Title:
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ROBUST INTERCONNECT STRUCTURE
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Patent #:
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Issue Dt:
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12/10/2002
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Application #:
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09340758
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Filing Dt:
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06/28/1999
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Title:
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LAMINATE HAVING PLATED MICROVIA INTERCONNECTS AND METHOD FOR FORMING THE SAME
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Patent #:
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Issue Dt:
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10/03/2000
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Application #:
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09344178
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Filing Dt:
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06/24/1999
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Title:
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SINGLE REFERENCE PlANE PLASTIC BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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12/03/2002
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Application #:
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09347580
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Filing Dt:
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07/01/1999
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Title:
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WIRE BONDING METHOD AND APPARATUS
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Patent #:
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Issue Dt:
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10/10/2000
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Application #:
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09365683
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Filing Dt:
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08/02/1999
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Title:
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NICKEL ALLOY FILMS FOR REDUCED INTERMETALLIC FORMATION IN SOLDER
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Patent #:
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Issue Dt:
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03/12/2002
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Application #:
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09379309
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Filing Dt:
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08/23/1999
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Title:
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PLACEMENT SYSTEM APPARATUS AND METHOD
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Patent #:
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Issue Dt:
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08/28/2001
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Application #:
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09388753
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Filing Dt:
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09/02/1999
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Title:
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SUBSTRATE STRUCTURE FOR IMPROVING ATTACHMENT RELIABILITY OF SEMICONDUCTOR CHIPS AND MODULES
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Patent #:
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Issue Dt:
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06/26/2001
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Application #:
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09388755
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Filing Dt:
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09/02/1999
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Title:
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METHOD FOR IMPROVING ATTACHMENT RELIABILITY OF SEMICONDUCTOR CHIPS AND MODULES
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Patent #:
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Issue Dt:
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10/30/2001
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Application #:
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09419881
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Filing Dt:
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10/18/1999
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Title:
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SEQUENTIAL ELECTRODEPOSITION OF METALS USING MODULATED ELECTRIC FIELDS FOR MANUFACTURE OF CIRCUIT BOARDS HAVING FEATURES OF DIFFERENT SIZES
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Patent #:
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Issue Dt:
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08/10/2004
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Application #:
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09438037
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Filing Dt:
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11/10/1999
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Title:
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PARTIALLY CAPTURED ORIENTED INTERCONNECTIONS FOR BGA PACKAGES AND A METHOD OF FORMING THE INTERCONNECTIONS
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Patent #:
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Issue Dt:
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12/11/2001
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Application #:
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09476958
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Filing Dt:
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01/03/2000
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Title:
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MULTIPLE ROW WIRE BONDING WITH BALL BONDS OF OUTER BOND PADS BONDED ON THE LEADS
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Patent #:
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Issue Dt:
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02/18/2003
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Application #:
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09481478
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Filing Dt:
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01/11/2000
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Title:
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WIRE BONDING TO DUAL METAL COVERED PAD SURFACES
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Patent #:
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Issue Dt:
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12/24/2002
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Application #:
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09503395
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Filing Dt:
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02/14/2000
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Title:
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SURFACE METAL BALANCING TO REDUCE CHIP CARRIER FLEXING
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Patent #:
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Issue Dt:
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03/25/2003
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Application #:
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09506951
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Filing Dt:
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02/18/2000
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Title:
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HIGH DENSITY DESIGN FOR ORGANIC CHIP CARRIERS
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Patent #:
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Issue Dt:
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01/01/2002
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Application #:
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09510996
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Filing Dt:
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02/22/2000
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Title:
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Method for preparing a conductive pad for electrical connection and conductive pad formed
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Patent #:
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Issue Dt:
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01/01/2002
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Application #:
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09517839
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Filing Dt:
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03/02/2000
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Title:
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Semiconductor flip-chip package and method for the fabrication thereof
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Patent #:
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Issue Dt:
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11/13/2001
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Application #:
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09520599
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Filing Dt:
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03/08/2000
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Title:
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Delayed start oscillator circuit
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Patent #:
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Issue Dt:
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07/02/2002
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Application #:
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09531971
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Filing Dt:
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03/20/2000
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Title:
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METHOD TO REDUCE NUMBER OF WIRE-BOND LOOP HEIGHTS VERSUS THE TOTAL QUANTITY OF POWER AND SIGNAL RINGS
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Patent #:
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Issue Dt:
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02/19/2002
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Application #:
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09538460
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Filing Dt:
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03/30/2000
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Title:
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Circuit board component retention
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|
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Patent #:
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|
Issue Dt:
|
10/16/2001
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Application #:
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09553616
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Filing Dt:
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04/20/2000
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Title:
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Electrodeposition of metals in small recesses using modulated electric fields
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Patent #:
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Issue Dt:
|
11/20/2001
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Application #:
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09553623
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Filing Dt:
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04/20/2000
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Title:
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Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates
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Patent #:
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Issue Dt:
|
08/28/2001
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Application #:
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09554418
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Filing Dt:
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05/11/2000
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Title:
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SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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Patent #:
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|
Issue Dt:
|
09/18/2001
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Application #:
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09554632
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Filing Dt:
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05/16/2000
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Title:
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SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
|
05/28/2002
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Application #:
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09632358
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Filing Dt:
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08/03/2000
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Title:
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SINGLE REFERENCE PLANE PLASTIC BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
|
09/03/2002
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Application #:
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09641413
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Filing Dt:
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08/18/2000
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Title:
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NICKEL ALLOY FILMS FOR REDUCED INTERMETALLIC FORMATION IN SOLDER
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Patent #:
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Issue Dt:
|
08/21/2001
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Application #:
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09644928
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Filing Dt:
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08/23/2000
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Title:
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Reduced skew timing scheme for write circuitry used in memory circuits
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Patent #:
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Issue Dt:
|
07/02/2002
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Application #:
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09651939
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Filing Dt:
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08/31/2000
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Title:
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LOCAL WRITE DRIVER CIRCUIT FOR AN INTEGRATED CIRCUIT DEVICE INCORPORATING EMBEDDED DYNAMIC RANDOM ACCESS MEMORY (DRAM)
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Patent #:
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Issue Dt:
|
02/11/2003
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Application #:
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09662641
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Filing Dt:
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09/15/2000
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Title:
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SEMICONDUCTOR FLIP-CHIP PACKAGE AND METHOD FOR THE FABRICATION THEREOF
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|
|
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Patent #:
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Issue Dt:
|
05/20/2003
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Application #:
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09662642
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Filing Dt:
|
09/15/2000
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Title:
|
SEMICONDUCTOR FLIP-CHIP PACKAGE AND METHOD FOR THE FABRICATION THEREOF
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|
|
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Patent #:
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Issue Dt:
|
08/23/2005
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Application #:
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09665366
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Filing Dt:
|
09/19/2000
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Title:
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ORGANIC DIELECTRIC ELECTRONIC INTERCONNECT STRUCTURES AND METHOD FOR MAKING
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|
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Patent #:
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Issue Dt:
|
03/26/2002
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Application #:
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09690170
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Filing Dt:
|
10/16/2000
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Title:
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Memory system for use on a circuit board in which the number of loads are minimized
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|
|
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Patent #:
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Issue Dt:
|
03/04/2003
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Application #:
|
09691935
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Filing Dt:
|
10/19/2000
|
|
Title:
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REDUCTION OF CHIP CARRIER FLEXING DURING THERMAL CYCLING
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Patent #:
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Issue Dt:
|
12/03/2002
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Application #:
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09703199
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Filing Dt:
|
10/31/2000
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|
Title:
|
MOLDED TAPE BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
|
11/12/2002
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Application #:
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09716165
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Filing Dt:
|
11/17/2000
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|
Title:
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METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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|
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Patent #:
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|
Issue Dt:
|
11/29/2005
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Application #:
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09716843
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Filing Dt:
|
11/17/2000
|
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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|
|
|
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Patent #:
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|
Issue Dt:
|
06/18/2002
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Application #:
|
09735980
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Filing Dt:
|
12/13/2000
|
|
Title:
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METHOD FOR INCREASING TRACE ROWS OF A BALL GRID ARRAY
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|
|
|
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Patent #:
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|
Issue Dt:
|
10/01/2002
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Application #:
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09765030
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Filing Dt:
|
01/17/2001
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Publication #:
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Pub Dt:
|
07/18/2002
| | | | |
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Title:
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CONDUCTIVE ADHESIVE INTERCONNECTION WITH INSULATING POLYMER CARRIER
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|
|
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Patent #:
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Issue Dt:
|
07/19/2005
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Application #:
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09768372
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Filing Dt:
|
01/23/2001
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|
Publication #:
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Pub Dt:
|
06/28/2001
| | | | |
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Title:
|
STRESS ACCOMMODATION IN ELECTRONIC DEVICE INTERCONNECT TECHNOLOGY FOR MILLIMETER CONTACT LOCATIONS
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|
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Patent #:
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Issue Dt:
|
10/01/2002
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Application #:
|
09774971
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Filing Dt:
|
01/31/2001
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|
Publication #:
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Pub Dt:
|
06/28/2001
| | | | |
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Title:
|
REWORK AND UNDERFILL NOZZLE FOR ELECTRONIC COMPONENTS
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|
|
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Patent #:
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|
Issue Dt:
|
12/16/2003
|
Application #:
|
09778702
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Filing Dt:
|
02/07/2001
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|
Publication #:
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Pub Dt:
|
07/12/2001
| | | | |
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Title:
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FULL ADDITIVE PROCESS WITH FILLED PLATED THROUGH HOLES
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|
|
|
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Patent #:
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|
Issue Dt:
|
09/17/2002
|
Application #:
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09781866
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Filing Dt:
|
02/12/2001
|
|
Title:
|
LAYOUT OF VDD AND VSS BALLS IN A FOUR LAYER PBGA
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|
|
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Patent #:
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|
Issue Dt:
|
10/15/2002
|
Application #:
|
09783642
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Filing Dt:
|
02/14/2001
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|
Publication #:
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Pub Dt:
|
07/05/2001
| | | | |
|
Title:
|
REWORK AND UNDERFILL NOZZLE FOR ELECTRONIC COMPONENTS
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|
|
|
|
Patent #:
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|
Issue Dt:
|
12/31/2002
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Application #:
|
09783643
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Filing Dt:
|
02/14/2001
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|
Publication #:
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|
Pub Dt:
|
08/29/2002
| | | | |
|
Title:
|
REWORK AND UNDERFILL NOZZLE FOR ELECTRONIC COMPONENTS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/16/2002
|
Application #:
|
09795852
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Filing Dt:
|
02/28/2001
|
|
Publication #:
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|
Pub Dt:
|
07/26/2001
| | | | |
|
Title:
|
FULL ADDITIVE PROCESS WITH FILLED PLATED THROUGH HOLES
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/11/2003
|
Application #:
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09805596
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Filing Dt:
|
03/13/2001
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|
Publication #:
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Pub Dt:
|
07/19/2001
| | | | |
|
Title:
|
TEMPORARY ATTACH ARTICLE AND METHOD FOR TEMPORARY ATTACH OF DEVICES TO A SUBSTRATE
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|
Patent #:
|
|
Issue Dt:
|
02/25/2003
|
Application #:
|
09823749
|
Filing Dt:
|
04/03/2001
|
|
Publication #:
|
|
Pub Dt:
|
05/16/2002
| | | | |
|
Title:
|
ELECTRODEPOSITION OF METALS IN SMALL RECESSES USING MODULATED ELECTRIC FIELDS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/08/2005
|
Application #:
|
09823750
|
Filing Dt:
|
04/03/2001
|
|
Publication #:
|
|
Pub Dt:
|
04/04/2002
| | | | |
|
Title:
|
SEQUENTIAL ELECTRODEPOSITION OF METALS USING MODULATED ELECTRIC FIELDS FOR MANUFACTURE OF CIRCUIT BOARDS HAVING FEATURES OF DIFFERENT SIZES
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|
|
|
|
Patent #:
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|
Issue Dt:
|
04/12/2005
|
Application #:
|
09823751
|
Filing Dt:
|
04/03/2001
|
|
Publication #:
|
|
Pub Dt:
|
03/21/2002
| | | | |
|
Title:
|
PULSE REVERSE ELECTRODEPOSITION FOR METALLIZATION AND PLANARIZATION OF SEMICONDUCTOR SUBSTRATES
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|
