Patent Assignment Details
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| Reel/Frame: | 026535/0156 | |
| Pages: | 10 |
| | Recorded: | 06/15/2011 | | |
| Attorney Dkt #: | 1143 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/05/2016
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Application #:
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12736625
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Filing Dt:
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05/03/2011
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Publication #:
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Pub Dt:
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08/25/2011
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Title:
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LEAD-FREE SOLDER ALLOY HAVING REDUCED SHRINKAGE CAVITIES
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Assignee
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| 23 SENJU-HASHIDO-CHO |
| ADACHI-KU |
| TOKYO 120-8555, JAPAN |
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Correspondence name and address
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MICHAEL TOBIAS
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1629 K STREET N. W.
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SUITE 300
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WASHINGTON, D.C. 20006
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