Patent Assignment Details
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| Reel/Frame: | 026698/0264 | |
| Pages: | 3 |
| | Recorded: | 07/28/2011 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13166101
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Filing Dt:
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06/22/2011
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Publication #:
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Pub Dt:
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12/29/2011
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Title:
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SEMICONDUCTOR MODULE WITH RESIN-MOLDED PACKAGE OF HEAT SPREADER AND POWER SEMICONDUCTOR CHIP
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Assignee
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| 1-1, SHOWA-CHO |
| KARIYA-CITY, AICHI-PREF., JAPAN 448-8661 |
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Correspondence name and address
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MICHELLE N. LESTER
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NIXON & VANDERHYE P.C.
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901 NORTH GLEBE ROAD
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11TH FLOOR
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ARLINGTON, VA 22203
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