Patent Assignment Details
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| Reel/Frame: | 026715/0749 | |
| Pages: | 4 |
| | Recorded: | 08/08/2011 | | |
| Attorney Dkt #: | MAR.DUK,101 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/08/2014
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Application #:
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13172161
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Filing Dt:
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06/29/2011
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Publication #:
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Pub Dt:
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01/03/2013
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Title:
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METHOD AND ARCHITECTURE FOR PRE-BOND PROBING OF TSVs IN 3D STACKED INTEGRATED CIRCUITS
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Assignee
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| OFFICE OF SCIENCE AND TECHNOLOGY |
| DURHAM, NORTH CAROLINA 27710 |
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Correspondence name and address
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SARAH J. KNIGHT
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PO BOX 142950
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GAINESVILLE, FL 32614-2950
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