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Reel/Frame:026717/0014   Pages: 5
Recorded: 08/08/2011
Attorney Dkt #:2011-0379/24061.1815
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/04/2014
Application #:
13112755
Filing Dt:
05/20/2011
Publication #:
Pub Dt:
11/22/2012
Title:
A BONDING PAD STRUCTURE FOR A BACKSIDE ILLUMINATED IMAGE SENSOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Assignors
1
Exec Dt:
05/24/2011
2
Exec Dt:
05/26/2011
3
Exec Dt:
05/24/2011
4
Exec Dt:
05/24/2011
5
Exec Dt:
05/24/2011
6
Exec Dt:
06/02/2011
Assignee
1
NO. 8, LI-HSIN RD. 6
SCIENCE BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondence name and address
HAYNES AND BOONE, LLP IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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