Patent Assignment Details
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| Reel/Frame: | 026735/0417 | |
| Pages: | 2 |
| | Recorded: | 08/10/2011 | | |
| Attorney Dkt #: | 149813 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/18/2014
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Application #:
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13156808
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Filing Dt:
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06/09/2011
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Publication #:
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Pub Dt:
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12/13/2012
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Title:
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LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME
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Assignees
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| 678 S. HILLVIEW DR. |
| MILPITAS, CALIFORNIA 95035 |
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| 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK |
| SAE TECHNOLOGY CENTRE |
| SHATIN, N.T., HONG KONG, CHINA |
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Correspondence name and address
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JAMES A. OLIFF
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OLIFF & BERRIDGE, PLC
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P.O. BOX 320850
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ALEXANDRIA, VA 22320-4850
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