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Reel/Frame:026762/0544   Pages: 4
Recorded: 08/17/2011
Attorney Dkt #:P46962US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/26/2016
Application #:
13211408
Filing Dt:
08/17/2011
Publication #:
Pub Dt:
02/21/2013
Title:
CHIP-PACKAGING MODULE FOR A CHIP AND A METHOD FOR FORMING A CHIP-PACKAGING MODULE
Assignor
1
Exec Dt:
08/17/2011
Assignee
1
AM CAMPEON 1-12
NEUBIBERG, GERMANY 85579
Correspondence name and address
VIERING, JENTSCHURA & PARTNER
3770 HIGHLAND AVE.
SUITE 203
MANHATTAN BEACH, CA 90266

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