Patent Assignment Details
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| Reel/Frame: | 026830/0759 | |
| Pages: | 4 |
| | Recorded: | 08/30/2011 | | |
| Attorney Dkt #: | AMDI:250\\HON |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/22/2015
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Application #:
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13221517
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Filing Dt:
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08/30/2011
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Publication #:
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Pub Dt:
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02/28/2013
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Title:
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METHODS OF FABRICATING SEMICONDUCTOR CHIP SOLDER STRUCTURES
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Assignee
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| ONE AMD PLACE, PO BOX 3453 |
| KEVIN A. O'NEIL |
| SUNNYVALE, CALIFORNIA 94088-3453 |
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Correspondence name and address
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TIMOTHY M. HONEYCUTT
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PO BOX 1577
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CYPRESS, TX 77410-1577
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