Patent Assignment Details
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| Reel/Frame: | 026837/0853 | |
| Pages: | 51 |
| | Recorded: | 08/31/2011 | | |
| Attorney Dkt #: | 1073-3 |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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10/02/2001
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Application #:
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09397136
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Filing Dt:
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09/16/1999
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Title:
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METHOD FOR FABRICATING CONTACT PAD FOR SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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10/01/2002
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Application #:
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09415267
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Filing Dt:
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10/12/1999
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Title:
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SEMICONDUCTOR CHIP PACKAGE AND METHOD OF FABRICATING SAME
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Assignee
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| SAN 136-1, AMI-RI, BUBAL-EUP, ICHEON-SHI |
| KYOUNGKI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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IP & T GROUP LLP
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7700 LITTLE RIVER TURNPIKE
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SUITE 207
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ANNANDALE, VA 22003
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