Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 026902/0607 | |
| Pages: | 4 |
| | Recorded: | 09/14/2011 | | |
| Attorney Dkt #: | 11263/HG |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/25/2013
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Application #:
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13193848
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Filing Dt:
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07/29/2011
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Publication #:
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Pub Dt:
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01/31/2013
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Title:
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LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION
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Assignee
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| 3993, NIGORIKAWA, KITA-KU |
| NIIGATA-SHI |
| NIIGATA, JAPAN 950-3131 |
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Correspondence name and address
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HOLTZ HOLTZ GOODMAN & CHICK PC
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220 FIFTH AVENUE
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16TH FLOOR
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NEW YORK, NY 10001-7708
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