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Reel/Frame:026934/0215   Pages: 18
Recorded: 09/20/2011
Attorney Dkt #:917-054; -063
Conveyance: MERGER (SEE DOCUMENT FOR DETAILS).
Total properties: 2
1
Patent #:
Issue Dt:
03/30/2004
Application #:
10197764
Filing Dt:
07/18/2002
Publication #:
Pub Dt:
07/31/2003
Title:
WATER-SOLUBLE PREFLUX, PRINTED CIRCUIT BOARD, AND PROCESS FOR TREATING THE SURFACE OF A METAL IN A PRINTED CIRCUIT BOARD
2
Patent #:
Issue Dt:
04/27/2004
Application #:
10384829
Filing Dt:
03/10/2003
Publication #:
Pub Dt:
09/25/2003
Title:
LEAD-FREE SOLDER, AND PASTE SOLDER COMPOSITION
Assignor
1
Exec Dt:
04/01/2010
Assignee
1
1-19-43, HIGASHI-OIZUMI
NERIMA-KU
TOKYO, JAPAN 178-8511
Correspondence name and address
TREVOR T. GRAVES
247 NORTH BROADWAY
LEXINGTON, KY 40507

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