Patent Assignment Details
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| Reel/Frame: | 026949/0585 | |
| Pages: | 4 |
| | Recorded: | 09/22/2011 | | |
| Attorney Dkt #: | N1085-00807 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/10/2014
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Application #:
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13198767
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Filing Dt:
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08/05/2011
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Publication #:
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Pub Dt:
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02/07/2013
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Title:
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CLEANING RESIDUAL MOLDING COMPOUND ON SOLDER BUMPS
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Assignee
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| NO. 8, LI-HSIN ROAD 6, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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WON-JOON KOUH, DUANE MORRIS LLP
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30 S. 17TH ST.
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PHILADELPHIA, PA 19103
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