Patent Assignment Details
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| Reel/Frame: | 027021/0854 | |
| Pages: | 7 |
| | Recorded: | 10/05/2011 | | |
| Attorney Dkt #: | B-7162 626645 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13253866
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Filing Dt:
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10/05/2011
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Publication #:
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Pub Dt:
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01/24/2013
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Title:
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SUBSTRATE FOR POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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Assignee
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| 314 MAETAN 3-DONG YEONGTONG-GU |
| SUWON |
| GYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
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Correspondence name and address
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LADAS & PARRY
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5670 WILSHIRE BOULEVARD, SUITE 2100
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LOS ANGELES, CA 90036-5679
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