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Reel/Frame:027047/0246   Pages: 2
Recorded: 10/12/2011
Attorney Dkt #:2005P04779WOUS
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/11/2011
Application #:
12085545
Filing Dt:
05/27/2008
Publication #:
Pub Dt:
10/15/2009
Title:
METHOD FOR REPAIRING CRACKS IN COMPONENTS AND SOLDER MATERIAL FOR SOLDERING COMPONENTS
Assignor
1
Exec Dt:
09/29/2011
Assignee
1
WITTELSBACHERPLATZ 2
MUNCHEN, GERMANY 80333
Correspondence name and address
SIEMENS CORPORATION
170 WOOD AVE SOUTH
IPD
ISELIN, NJ 08830

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