Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 027110/0629 | |
| Pages: | 3 |
| | Recorded: | 10/24/2011 | | |
| Attorney Dkt #: | 851663.483 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12495734
|
Filing Dt:
|
06/30/2009
|
|
Publication #:
|
|
Pub Dt:
|
07/01/2010
| | | | |
|
Title:
|
REDUCING WARPAGE FOR FAN-OUT WAFER LEVEL PACKAGING
|
|
|
Assignee
|
|
|
|
|
| 28 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569508 |
|
|
Correspondence name and address
|
| |
HAYLEY J. STEVENS
|
| |
701 FIFTH AVENUE
|
| |
SUITE 5400
|
| |
SEATTLE, WA 98104
|
Search Results as of:
05/15/2024 06:18 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
