Patent Assignment Details
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| Reel/Frame: | 027110/0670 | |
| Pages: | 3 |
| | Recorded: | 10/24/2011 | | |
| Attorney Dkt #: | 851663.480 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/21/2012
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Application #:
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12330044
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Filing Dt:
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12/08/2008
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Publication #:
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Pub Dt:
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06/10/2010
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Title:
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MANUFACTURING FAN-OUT WAFER LEVEL PACKAGING
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Assignee
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| 28 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569508 |
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Correspondence name and address
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HAYLEY J. STEVENS
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701 FIFTH AVENUE
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SUITE 5400
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SEATTLE, WA 98104
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